1、首屆全球IC企業(yè)家大會(huì)First Globle Ic Entrepreneur Centerence會(huì)議手冊(cè)Conference Manual中國(guó)上海/ ShanghaiChina201812/December2018卷首語60年前，杰克基爾比開發(fā)出世界上第一顆集成電路。作為20世紀(jì)最偉大的發(fā)明之一，集成電路技術(shù)的創(chuàng)新和應(yīng)用開啟了人類信息社會(huì)的新紀(jì)元。回望集成電路發(fā)明60 年的風(fēng)雨歷程，回首中國(guó)改革開放40年的發(fā)展征程，企業(yè)家是推動(dòng)集成電路產(chǎn)業(yè)發(fā)展的重要力量。一代又一代、一批又一批企業(yè)家銳意創(chuàng)新、精誠(chéng)合作，抓住摩爾定律的發(fā)展脈搏，敏銳捕捉市場(chǎng)機(jī)遇，持續(xù)推進(jìn)產(chǎn)品創(chuàng)新、技術(shù)創(chuàng)新、市場(chǎng)創(chuàng)新，不斷打造

2、新產(chǎn)業(yè)、新業(yè)態(tài)、新模式。目前，集成電路工藝已經(jīng)達(dá)到7納米，晶體管密度每平方毫米突破1億個(gè)，全球集成電路產(chǎn)業(yè)市場(chǎng)規(guī)模已經(jīng)達(dá)到4000多億美元。企業(yè)家們銳意創(chuàng)新、開拓進(jìn)取，不僅為人類社會(huì)創(chuàng)造了巨大的財(cái)富，而且改變了人類的生活方式和生產(chǎn)方式，改變了人類文明的進(jìn)程。60年一個(gè)甲子。當(dāng)今世界，集成電路產(chǎn)業(yè)發(fā)展進(jìn)入后摩爾時(shí)代。如何把握集成電路的技術(shù)演進(jìn)路線？如何抓住互聯(lián)網(wǎng)、大數(shù)據(jù)、人工智能蓬勃發(fā)展的巨大市場(chǎng)？如何抓住中國(guó)新一輪改革開放的歷史機(jī)遇，實(shí)現(xiàn)新增長(zhǎng)，期冀在中國(guó)上海，來自全球的企業(yè)家共享發(fā)展成果，共商發(fā)展大計(jì)，高高揚(yáng)起“開放發(fā)展，合作共贏”之帆，共同引領(lǐng)集成電路產(chǎn)業(yè)駛向更加輝煌的明天。Sixty y

3、ears ago, Jack Kilby created the worlds first integrated circuit.As one of the greatest inventions of the 20th century,the integrated circuit technology has opened a new era of human information society .Over the 60-year evolution of integrated circuits and the 40-year reform and opening up of China

4、,entrepreneurs have always been the essential drivers in the development of the integrated circuit industry.From generation to generation, these innovative and cooperative entrepreneurs have strictly followed the Moores Law and wisely seized market opportunities.They are promoting innovations in pro

5、duct, technology and market,and creating new industries, formats and models.Today, the size of integrated circuits has been reduced to 7 nanometers, the transistor density has exceeded 100 million units per square millimeter, and the global integrated circuit market has reached more than 400 billion

6、 US dollars.By innovating and exploring,the entrepreneurs have changed the way people live and produce.In the Chinese calendar, 60 years form a cycle.In todays world, the development of the integrated circuit industry has entered the post-Moore era.How to grasp the technological evolution route of i

7、ntegrated circuits?How to utilize the vigorous and huge markets of the Internet, big data and artificial intelligence?How to achieve new growth by seizing the historical opportunity of China in a new round of reform and opening up? Entrepreneurs from all over the world will share the achievements an

8、d discuss the masterplan of development in Shanghai.The integrated circuit industry in Shanghai is expected to uphold the banner of “Open to Develop and Cooperate to Win”, leading the integrated circuit industry to a brilliant future.首屆全球IC企業(yè)家大會(huì)First Globle Ic Entrepreneur Centerence會(huì)議直播二維碼Scan QR C

9、ode for Conference Live Stream目錄1.組織機(jī)構(gòu)2.總體概況3大會(huì)日程4活動(dòng)安排4.1開幕式4.2主論壇4.3分論壇一：集成電路設(shè)計(jì)技術(shù)與創(chuàng)新論壇4.4分論壇二：先進(jìn)封裝技術(shù)創(chuàng)新論壇4.5分論壇三：半導(dǎo)體產(chǎn)業(yè)投資與創(chuàng)新分論壇4.6分論壇四：集成電路產(chǎn)業(yè)鏈創(chuàng)新發(fā)展論壇4.7分論壇五：2018年海峽兩岸（上海）集成電路產(chǎn)業(yè)合作發(fā)展論壇4.8分論壇六：RISC-V創(chuàng)新應(yīng)用暨開發(fā)者論壇組織機(jī)構(gòu) Organization總體概況 Overview大會(huì)日程 Conference Agenda活動(dòng)安排 Activity Arrangements4.1開幕式 Opening Cer

10、emony4.2主論壇 Main Forum4.3分論壇一：集成電路設(shè)計(jì)技術(shù)與創(chuàng)新論壇 Sub-Forum One: Design Technique and Innovation of Integrated Circuit4.4分論壇二：先進(jìn)封裝技術(shù)創(chuàng)新論壇 Sub-Forum Two: Innovation in Advanced Package Technology4.5分論壇三：半導(dǎo)體產(chǎn)業(yè)投資與創(chuàng)新分論壇Sub-Forum Three: Investment and Innovation in Semiconductor Industry4.6分論壇四：集成電路產(chǎn)業(yè)鏈創(chuàng)新發(fā)展論壇Sub

11、-Forum Four: Innovative Development of Integrated Circuit Industrial Chain4.7分論壇五：2018年海峽兩岸（上海）集成電路產(chǎn)業(yè)合作發(fā)展論壇 Sub-Forum Five: Cooperative Development of IC Industry Across the Taiwan Strait(Shanghai) 20184.8分論壇六：RISC-V創(chuàng)新應(yīng)用暨開發(fā)者論壇Sub-Forum Six: The Innovative Application of RISC-V and Its Developers總體概況

12、Overview大會(huì)日程 時(shí)間：12月11日-12月12日地點(diǎn)：上海浦東嘉里大酒店Conference Agenda Time: 11-12, DecemberVenue: Kerry Hotel, Pudong Shanghai2018年12月11日 09:30-10:30 開幕式 上海大宴會(huì)廳 10:30-12:00 開幕演講 上海大宴會(huì)廳14:00-16:30 主旨演講 上海大宴會(huì)廳18:00-20:00首屆全球IC企業(yè)家大會(huì)“中國(guó)之夜”（受邀出席）December 11, 201809:30-10:30 Opening Ceremony Shanghai Grand Banquet H

13、all 10:30-12:00 Opening Speech Shanghai Grand Banquet Hall 14:00-16:30 Keynote Speech Shanghai Grand Banquet Hall18:00-20:00The First Global IC Entrepreneur Conference “China Night” (Invited Only)2018年12月12日 09:30-12:25 分論壇一：集成電路設(shè)計(jì)技術(shù)與創(chuàng)新論壇 三層浦東宴會(huì)廳1-309:30-12:05 分論壇二：先進(jìn)封裝技術(shù)創(chuàng)新論壇 三層浦東宴會(huì)廳409:30-12:10 分論壇

14、三：半導(dǎo)體產(chǎn)業(yè)投資與創(chuàng)新分論壇 三層浦東宴會(huì)廳5-713:30-16:10 分論壇四：集成電路產(chǎn)業(yè)鏈創(chuàng)新發(fā)展論壇 三層浦東宴會(huì)廳1-313:20-16:30 分論壇五：2018年海峽兩岸（上海）集成電路產(chǎn)業(yè)合作發(fā)展論壇 三層浦東宴會(huì)廳413:30-16:50 分論壇六：RISC-V創(chuàng)新應(yīng)用暨開發(fā)者論壇 三層浦東宴會(huì)廳5-7December 12, 201809:30-12:25 Sub-Forum One: Design Technique and Innovation of Integrated Circuit Pudong Banquet Hall 1-3, Third Floor09:3

15、0-12:05 Sub-Forum Two: Innovation in Advanced Package Technology Pudong Banquet Hall 4, Third Floor09:30-12:10 Sub-Forum Three: Investment and Innovation in Semiconductor Industry Pudong Banquet Hall 5-7, Third Floor13:30-16:10 Sub-Forum Four: Innovative Development of Integrated Circuit Industrial

16、Chain Pudong Banquet Hall 1-3, Third Floor13:20-16:30 Sub-Forum Five: Cooperative Development of IC Industry Across the Taiwan Strait(Shanghai) 2018 Pudong Banquet Hall 4, Third Floor13:30-16:50 Sub-Forum Six: The Innovative Application of RISC-V and Its Developers Pudong Banquet Hall 5-7, Third Flo

17、or活動(dòng)安排2018年12月11日 首屆全球IC企業(yè)家大會(huì) 上海浦東嘉里大酒店上海大宴會(huì)廳Activity ArrangementsDecember 11, 2018 First Global IC Entrepreneur Conference Shanghai Grand Banquet Hall, Kerry Hotel, Pudong Shanghai組織機(jī)構(gòu)指導(dǎo)單位工業(yè)和信息化部上海市人民政府主辦單位中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)中國(guó)電子信息產(chǎn)業(yè)發(fā)展研究院承辦單位北京賽迪會(huì)展有限公司中國(guó)電子報(bào)社上海市集成電路行業(yè)協(xié)會(huì)協(xié)辦單位中國(guó)電子專用設(shè)備工業(yè)協(xié)會(huì)中國(guó)電子材料行業(yè)協(xié)會(huì)中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)集成電路設(shè)

18、計(jì)分會(huì)、集成電路分會(huì)、封裝分會(huì)、半導(dǎo)體分立器件分會(huì)、半導(dǎo)體支撐業(yè)分會(huì)、MEMS分會(huì)北京半導(dǎo)體行業(yè)協(xié)會(huì)天津市集成電路行業(yè)協(xié)會(huì)重慶市半導(dǎo)體行業(yè)協(xié)會(huì)江蘇省半導(dǎo)體行業(yè)協(xié)會(huì)浙江省半導(dǎo)體行業(yè)協(xié)會(huì)湖北省半導(dǎo)體行業(yè)協(xié)會(huì)廣東省半導(dǎo)體行業(yè)協(xié)會(huì)陜西省半導(dǎo)體行業(yè)協(xié)會(huì)深圳市半導(dǎo)體行業(yè)協(xié)會(huì)廈門市集成電路行業(yè)協(xié)會(huì)大連市半導(dǎo)體行業(yè)協(xié)會(huì)南京市集成電路行業(yè)協(xié)會(huì)合肥市半導(dǎo)體行業(yè)協(xié)會(huì)蘇州市集成電路行業(yè)協(xié)會(huì)無錫市半導(dǎo)體行業(yè)協(xié)會(huì)官方網(wǎng)站： HYPERLINK http:/www.IC-C www.IC-CThe First Global IC Entrepreneur ConferenceTheme: Open development

19、and win-win cooperationTime: December 11 to 12, 2018 Location: Kerry Hotel in Pudong, ShanghaiGuided by: Ministry of Industry and Information Technology of the PRC (MIIT); and Shanghai Municipal Peoples GovernmentHeld by: China Semiconductor Industry Association (CSIA); and China Center for Informat

20、ion Industry Development (CCID)Organized by: CCID Exhibition Company; China Electronics News Agency (CENA); and Shanghai Integrated Circuit Industry Association (SICA)Co-organized by: China Electronic Production Equipment Industry Association (CEPEA); China Electronic Materials Industry Association

21、(CEMIA); the IC Design Branch, the Packaging Branch, the Semiconductor Discrete Device Branch, the Semiconductor Support Branch and the MEMS Branch of China Semiconductor Industry Association (CSIA); Beijing Semiconductor Industry Association; Tianjin IC Industry Association; Chongqing Semiconductor

22、 Industry Association; Jiangsu Semiconductor Industry Association; Zhejiang Semiconductor Industry Association; Hubei Semiconductor Industry Association; Guangdong Semiconductor Industry Association; Shaanxi Semiconductor Industry Association; Shenzhen Semiconductor Industry Association; Xiamen IC I

23、ndustry Association; Dalian Semiconductor Industry Association; Nanjing IC Industry Association; Hefei Semiconductor Industry Association; Suzhou IC Industry Association; and Wuxi Semiconductor Industry AssociationOfficial Website: HYPERLINK http:/www.IC-C www.IC-C總體概況基本情況會(huì)議名稱首屆全球IC企業(yè)家大會(huì)會(huì)議主題開放發(fā)展、合作共

24、贏會(huì)議時(shí)間12月11日-12月12日會(huì)議地點(diǎn)上海浦東嘉里大酒店大會(huì)日程 時(shí)間：12月11日-12月12日地點(diǎn)：上海浦東嘉里大酒店2018年12月11日 09:30-10:30 開幕式 上海大宴會(huì)廳 10:30-12:00 開幕演講 上海大宴會(huì)廳14:00-16:30 主旨演講 上海大宴會(huì)廳18:30-20:00首屆全球IC企業(yè)家大會(huì)“中國(guó)之夜”（受邀出席）2018年12月12日 09:30-12:25 分論壇一：集成電路設(shè)計(jì)技術(shù)與創(chuàng)新論壇 三層浦東宴會(huì)廳1-309:30-12:05 分論壇二：先進(jìn)封裝技術(shù)創(chuàng)新論壇 三層浦東宴會(huì)廳409:30-12:10 分論壇三：半導(dǎo)體產(chǎn)業(yè)投資與創(chuàng)新分論壇 三

25、層浦東宴會(huì)廳5-713:30-16:10 分論壇四：集成電路產(chǎn)業(yè)鏈創(chuàng)新發(fā)展論壇 三層浦東宴會(huì)廳1-313:20-16:30 分論壇五：2018年海峽兩岸（上海）集成電路產(chǎn)業(yè)合作發(fā)展論壇 三層浦東宴會(huì)廳413:30-16:50 分論壇六：RISC-V創(chuàng)新應(yīng)用暨開發(fā)者論壇 三層浦東宴會(huì)廳5-7活動(dòng)安排2018年12月11日 首屆全球IC企業(yè)家大會(huì) 上海浦東嘉里大酒店上海大宴會(huì)廳首屆全球IC企業(yè)家大會(huì)日程安排 時(shí)間日程安排 12月11日 會(huì)議地點(diǎn)：上海浦東嘉里大酒店上海大宴會(huì)廳展覽地點(diǎn)：上海新國(guó)際博覽中心W3館08:30-09:30領(lǐng)導(dǎo)參觀第十六屆中國(guó)國(guó)際半導(dǎo)體博覽會(huì) （IC China）首屆全球I

26、C企業(yè)家大會(huì)暨第十六屆中國(guó)國(guó)際半導(dǎo)體博覽會(huì)開幕式09:30-09:40播放開場(chǎng)視頻09:40-09:45主持人開場(chǎng)09:45-09:55致辭中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)理事長(zhǎng)中芯國(guó)際集成電路制造有限公司董事長(zhǎng)周子學(xué)09:55-10:05致辭美國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)輪值主席Marvell公司總裁兼首席執(zhí)行官 Matt Murphy 10:05-10:15領(lǐng)導(dǎo)致辭工業(yè)和信息化部領(lǐng)導(dǎo)10:15-10:25領(lǐng)導(dǎo)致辭 上海市領(lǐng)導(dǎo)10:25-10:30休 會(huì)首屆全球IC企業(yè)家大會(huì) 開幕演講10:30-10:45主題演講紫光集團(tuán)有限公司董事長(zhǎng) 趙偉國(guó)10:45-11:00主題演講Cadence公司CEO 陳立武11:00-

27、11:15主題演講三星電子有限責(zé)任公司執(zhí)行副總裁 Greg Yang11:15-11:30主題演講瑞薩電子株式會(huì)社高級(jí)副總裁、瑞薩電子中國(guó)董事長(zhǎng)真岡朋光11:30-11:45主題演講SEMI全球總裁兼首席執(zhí)行官 Ajit Manocha11:45-12:00主題演講中國(guó)電子信息產(chǎn)業(yè)發(fā)展研究院院長(zhǎng) 盧山首屆全球IC企業(yè)家大會(huì) 主旨演講14:00-14:20主題演講國(guó)家集成電路產(chǎn)業(yè)投資基金總裁 丁文武14:20-14:40主題演講美國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)副總裁Jimmy Goodrich 14:40-15:00主題演講華潤(rùn)微電子有限公司常務(wù)副董事長(zhǎng) 陳南翔15:00-15:20主題演講美國(guó)高通公司中國(guó)區(qū)

28、董事長(zhǎng) 孟樸15:20-15:30茶歇15:30-15:50主題演講英飛凌科技公司大中華區(qū)總裁 蘇華15:50-16:10主題演講Arm中國(guó)執(zhí)行董事長(zhǎng)兼CEO 吳雄昂16:10-16:30主題演講RISC-V基金會(huì)主席 Krste Asanovic16:30-16:50主題演講上海武岳峰高科技創(chuàng)業(yè)投資管理有限公司創(chuàng)始合伙人 武平18:00-20:00首屆全球IC企業(yè)家大會(huì)暨IC China 2018“中國(guó)之夜”（受邀出席）First Globle IC Entrepreneur CenterenceTimeConference AgendaDecember 11, 2018 Conferenc

29、e Address：Shanghai Grand Banquet Hall, Kerry Hotel, Pudong ShanghaiExhibition Address：Shanghai New International Expo Centre W308:30-09:30Leaders Visit IC China 2018Opening Ceremony of First Global IC Entrepreneur Centerence and IC China201809:30-09:40Opening vide09:40-09:45moderator for opening rem

30、arks09:45-09:55SpeechZhou ZixueChairman Of CSIA,Chairman of the Board Of Semiconductor Manufacturing International Corporation09:55-10:05SpeechMatt MurphyPresident and Chief Executive Officer10:05-10:15President SpeechLeader Of MIIT10:15-10:25President Speech Government Leader Of Shanghai10:25-10:30

31、AdjournFirst Globle IC Entrepreneur Centerence Opening Speech10:30-10:45Keynote SpeechVictor ZhaoTsinghua Unigroup Chairman10:45-11:00Keynote SpeechLip-Bu Tan Cadence CEO11:00-11:15Keynote SpeechGreg YangExecutive Vice President Of Samsung Electronics 11:15-11:30Keynote Speech瑞薩電子株式會(huì)社高級(jí)副總裁、瑞薩電子中國(guó)董事長(zhǎng)

32、真岡朋光11:30-11:45Keynote SpeechAjit ManochaThe president and CEO of SEMI11:45-12:00Keynote SpeechChina Center of information Industry Development president Lu ShanFirst Globle IC Entrepreneur Centerence Keynote Speech14:00-14:20Keynote SpeechDing Wenwu China Intergrated Circuit Industry Investment Fun

33、d Co.,Ltd.President14:20-14:40Keynote SpeechJimmy GoodrichVice President, Global Policy at SIA14:40-15:00Keynote SpeechDr. Nanxiang ChenChina Resources Microelectronics Ltd.Executive Vice Chairman15:00-15:20Keynote SpeechFrank MengChairman of Qualcomm China15:20-15:30 Tea Break15:30-15:50Keynote Spe

34、echSU HUAInfineon Technologies China Co. Ltd.，President of Greater China Region15:50-16:10Keynote SpeechAllen WuExecutive Chairman and CEO of Arm Technology (China) Co. Ltd16:10-16:30Keynote SpeechKrste Asanovicprofessor in the EECS Department at the University of California, Berkeley (UC Berkeley).

35、16:30-16:50Keynote Speech武平Shanghai Wuyuefeng High-tech Venture Capital Management Co. Ltd 創(chuàng)始合伙人 18:00-20:00The First Global IC Entrepreneur Conference “China Night” (Invited Only)分論壇一：中文分論壇一：集成電路設(shè)計(jì)技術(shù)與創(chuàng)新論壇主題：新趨勢(shì) 芯機(jī)遇時(shí)間：2018年12月12日上午地點(diǎn)：上海浦東嘉里大酒店三層浦東宴會(huì)廳1-3承辦：中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)設(shè)計(jì)分會(huì)會(huì)議日程(擬)時(shí)間主題嘉賓主持人：中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)集成電路設(shè)

36、計(jì)分會(huì)秘書長(zhǎng) 程晉格 09:3009:55人工智能芯片發(fā)展超威半導(dǎo)體有限公司院士 楊 建09:5510:20人工智能芯片挑戰(zhàn)與實(shí)現(xiàn)Cadence產(chǎn)品工程高級(jí)總監(jiān) 劉 淼10:2010:45全球半導(dǎo)體IP產(chǎn)業(yè)的發(fā)展趨勢(shì)Snopsys全球IP產(chǎn)品資深專家 劉好朋10:4511:10從芯片到方案：人工智能芯片產(chǎn)品趨勢(shì)Xilinx人工智能業(yè)務(wù)高級(jí)總監(jiān)/深鑒科技聯(lián)合創(chuàng)始人 姚 頌11:1011:35CMOS 圖像傳感器應(yīng)用及市場(chǎng)動(dòng)態(tài)豪威科技全球市場(chǎng)及銷售高級(jí)副總裁吳曉東11:3512:00新形態(tài) 新機(jī)遇談中國(guó)IC設(shè)計(jì)產(chǎn)業(yè)的正面戰(zhàn)場(chǎng)周 晨Eric Zhou紫光展銳市場(chǎng)副總裁Marketing VP,UNI

37、中英文：分論壇一：集成電路設(shè)計(jì)技術(shù)與創(chuàng)新論壇Sub-Forum One: Design Technique and Innovation of Integrated Circuit主題：新趨勢(shì) 芯機(jī)遇Theme: New Trend Brings New Opportunity時(shí)間：2018年12月12日上午地點(diǎn)：上海浦東嘉里大酒店三層浦東宴會(huì)廳1-3承辦：中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)設(shè)計(jì)分會(huì)會(huì)議日程(擬)Time: Morning, December 12, 2018Venue: Pudong Banquet Hall 1-3, third floor of Kerry Hotel Pudong Sh

38、anghaiOrganizer: Design Branch of China Semiconductor Industry AssociationMeeting Schedule(draft)分論壇一全英文：Sub-Forum One: Design Technique and Innovation of Integrated CircuitTheme: New Trend Brings New OpportunityTime: Morning, December 12, 2018Venue: Pudong Banquet Hall 1-3, third floor of Kerry Hot

39、el Pudong ShanghaiOrganizer: Design Branch of China Semiconductor Industry AssociationMeeting Schedule(draft)TimeThemeSpeakerPresenter: Cheng Jinge, secretary general of the Design Branch of China Semiconductor Industry Association 09:3009:55AI Chip Development (TBC) Yang Jian, Fellow, AMD China09:5

40、510:20AI-ML Chip Challenge and Implementation Miao Liu Product Engineering Group Director, Cadence Design System10:2010:45Development Trends of Global Semiconductor IP IndustryHaopeng Liu IP Technical Solution Expert, Synopsys10:4511:10From FPGA to Solution: Trend of Artificial Intelligence Products

41、 Song Yao Xilinx Technology Beijing Limited，Sr Dr of Product MarketingCo-founder Of DeePhi11:1011:35CMOS Image Sensor Application and Market Trend Michael Wu SVP Worldwide Marketing and Sales, OmniVision technologies11:3512:00New Form, New Chance, the frontal battlefield of IC Design Industry in Chi

42、naEric Zhou Marketing VP,UNI分論壇二：先進(jìn)封裝技術(shù)創(chuàng)新論壇主題：封裝產(chǎn)業(yè)新發(fā)展 新未來時(shí)間：2018年12月12日上午地點(diǎn)：上海浦東嘉里大酒店三層浦東宴會(huì)廳4承辦：中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)封裝分會(huì)會(huì)議日程(擬)時(shí)間主題嘉賓主持人：中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)封裝分會(huì)秘書長(zhǎng) 王紅09:3009:35主持人介紹嘉賓09:3510:00中國(guó)半導(dǎo)體封裝產(chǎn)業(yè)現(xiàn)狀與展望封裝分會(huì)輪值理事長(zhǎng)、通富微電董事長(zhǎng) 石明達(dá)10:0010:25先進(jìn)集成電路IC封裝技術(shù)的新發(fā)展江蘇長(zhǎng)電科技股份有限公司高級(jí)副總裁 梁新夫10:2510:50先進(jìn)三維晶圓級(jí)系統(tǒng)級(jí)封裝關(guān)鍵技術(shù)進(jìn)展與應(yīng)用華天科技（集團(tuán)）技術(shù)總監(jiān) CT

43、O 于大全10:5011:157納米制程高端處理器先進(jìn)封裝技術(shù)蘇州通富超威半導(dǎo)體有限公司封裝部工程運(yùn)營(yíng)總監(jiān) 陳傳興11:1511:40傳感器等產(chǎn)品的扇出封裝應(yīng)用蘇州晶方半導(dǎo)體科技股份有限公司副總經(jīng)理 劉宏鈞11:4012:05扇出封裝技術(shù)的研發(fā)進(jìn)程華進(jìn)半導(dǎo)體封裝先導(dǎo)技術(shù)研發(fā)中心有限公司總監(jiān) 姚大平中英文:分論壇二：先進(jìn)封裝技術(shù)創(chuàng)新論壇Sub-Forum Two: Innovation in Advanced Package Technology主題：封裝產(chǎn)業(yè)新發(fā)展 新未來Theme: New Developments in the Package Industry Bring New Futu

44、re時(shí)間：2018年12月12日上午地點(diǎn)：上海浦東嘉里大酒店三層浦東宴會(huì)廳4承辦：中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)封裝分會(huì)會(huì)議日程(擬)Time: Morning, December 12, 2018Venue: Pudong Banquet Hall 4, third floor of Kerry Hotel Pudong ShanghaiOrganizer: Package Branch of China Semiconductor Industry AssociationMeeting Schedule(draft)全英文：Sub-Forum Two: Innovation in Advanced P

45、ackage TechnologyTheme: New Developments in the Package Industry Bring New FutureTime: Morning, December 12, 2018Venue: Pudong Banquet Hall 4, third floor of Kerry Hotel Pudong ShanghaiOrganizer: Package Branch of China Semiconductor Industry AssociationMeeting Schedule(draft)TimeThemeSpeakerWang Ho

46、ng, secretary general (Yu Guoliang, deputy secretary general) of the Package Branch of China Semiconductor Industry Association09:3009:35Introducing guests09:3510:00Current Status and Prospects of China Semiconductor Packaging Industry Mingda ShiRotating Chairman of China Semiconductor Industry Asso

47、ciationBoard Chairman of TongFu Microelectronics Co.,Ltd.10:0010:25New Development for Advanced IC Packaging TechnologiesSteve Xin LiangSenior Vice President Of Jiangsu Changjiang Electronics Technology Co., Ltd.10:2510:50Progress and Applications for Advanced 3D Wafer Level System Integration Techn

48、ologyDaquan Yu CTO of Huatian Technology (Kunshan) Electronic Co., Ltd.10:5011:157nm CPU Advanced Packaging Technology DH DingDirector Manufacturing Engineering Of Suzhou TF-AMD Semiconductor CO., LTD Introduction11:1511:40Fan-outs as an Interconnect Technology for Sensors etc.Russell LiuVP Of China

49、 Wafer Level CSP Co. Ltd11:4012:05Progress in Fanout Packaging Technology DevelopmentYao DapingTechnicalDirector Of National Center for Advanced Packaging Co, Ltd.分論壇三：半導(dǎo)體產(chǎn)業(yè)投資與創(chuàng)新分論壇主題：新形勢(shì) 新策略時(shí)間：2018年12月12日上午地點(diǎn)：上海浦東嘉里大酒店三層浦東宴會(huì)廳5-7承辦：賽迪顧問股份有限公司、中國(guó)電子報(bào)社會(huì)議日程(擬) 時(shí)間議題嘉賓主持人：賽迪顧問股份有限公司副總裁 李 珂09:30-09:50利用好海外

50、并購(gòu)，助推中國(guó)半導(dǎo)體產(chǎn)業(yè)穩(wěn)步向好發(fā)展中建投資本管理（天津）有限公司總經(jīng)理 高立里09:50-10:10資本與技術(shù)融合，打造自主可控的IC產(chǎn)業(yè)集群上海集成電路產(chǎn)業(yè)投資基金管理有限公司董事長(zhǎng) 沈偉國(guó)10:10-10:30行業(yè)發(fā)展半導(dǎo)體的宏觀視角解析畢馬威首席經(jīng)濟(jì)學(xué)家 康 勇10:30-10:50新形勢(shì)下的半導(dǎo)體產(chǎn)業(yè)投資策略元禾華創(chuàng)(蘇州)投資管理有限公司投委會(huì)主席陳大同10:50-11:10汽車半導(dǎo)體產(chǎn)業(yè)趨勢(shì)與化合物投資機(jī)遇福建省安芯投資管理有限責(zé)任公司管理合伙人 周貞宏11:10-11:30世界變局下的中國(guó)半導(dǎo)體產(chǎn)業(yè)芯原微電子董事長(zhǎng)兼總裁 戴偉民11:30-11:50細(xì)分領(lǐng)域深耕，助力中國(guó)集成電

51、路產(chǎn)業(yè)發(fā)展廈門半導(dǎo)體投資集團(tuán)有限公司總經(jīng)理 王匯聯(lián)11:50-12:10碳化硅功率器件技術(shù)與應(yīng)用深圳基本半導(dǎo)體有限公司總經(jīng)理 和巍巍中英文：分論壇三：半導(dǎo)體產(chǎn)業(yè)投資與創(chuàng)新分論壇Sub-Forum Three: Investment and Innovation in Semiconductor Industry主題：新形勢(shì) 新策略Theme: New Circumstances, New Strategy時(shí)間：2018年12月12日上午地點(diǎn)：上海浦東嘉里大酒店三層浦東宴會(huì)廳5-7承辦：賽迪顧問股份有限公司、中國(guó)電子報(bào)社Time: Morning, December 12, 2018Venue:

52、 Pudong Banquet Hall 5-7, third floor of Kerry Hotel Pudong ShanghaiOrganizer: CCID Consulting Co. Ltd, China Electronic News全英文：Sub-Forum Three: Investment and Innovation in Semiconductor IndustryTheme: New Circumstances, New StrategyTime: Morning, December 12, 2018Venue: Pudong Banquet Hall 5-7, t

53、hird floor of Kerry Hotel Pudong ShanghaiOrganizer: CCID Consulting Co. Ltd, China Electronic NewsTimeThemeSpeakerPresenter: Li Ke, Vice President of CCID Consulting Co. Ltd09:30-09:50Making good use of overseas mergers and acquisitions, boosting the Chinas semiconductor industryGao LiliGeneral Mana

54、ger of JIC Capital09:50-10:10The integration of capital and technology leads to a IC industrial cluster with independent IPRPresident of Shanghai IC Industry Investment Fund Management Co., Ltd. Shen Weiguo10:10-10:30Macroscopic Analysis to the Development of Semiconductor IndustryDr. Kevin KangChie

55、f Economist of KPMG China10:30-10:50Investment strategy of the semiconductor industry under new situationChen DatongHua Capital Chairman of the Investment Committee10:50-11:10Trends and opportunities in Automotive electronics and compound semiconductor investmentAlan ZhouAn Xin Capital Co. Ltd. Mana

56、ging Partner11:10-11:30Chinas IC Industry under great changes in the world Wayne Dai VeriSilicon Chairman, President and CEO11:30-11:50Hard working in subdivided area of semiconductor industry, powering up the development of Chinas IC IndustryHuilian WangCompany: Xiamen Semiconductor Investment Grou

57、p co., LTD.Position: Managing Director11:50-12:10Technoligy and Application of Silicon Carbide Power DevicesWeiwei HE Shenzhen BASiC Semiconductor Ltd. CEO分論壇四：集成電路產(chǎn)業(yè)鏈創(chuàng)新發(fā)展論壇主題：構(gòu)建技術(shù)創(chuàng)新鏈 提升產(chǎn)業(yè)競(jìng)爭(zhēng)力時(shí)間：2018年12月12日下午地點(diǎn)：上海浦東嘉里大酒店三層浦東宴會(huì)廳1-3承辦：中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)集成電路分會(huì)、中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)支撐業(yè)分會(huì)會(huì)日議程(擬)時(shí)間主題嘉賓 主持人：中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)副理事長(zhǎng) 于燮康13:

58、30-13:40主持人介紹嘉賓13:40-14:05聚焦戰(zhàn)略機(jī)遇，建立核心競(jìng)爭(zhēng)力寧波江豐電子材料股份有限公司董事長(zhǎng) 姚力軍14:05-14:30國(guó)產(chǎn)8英寸成套設(shè)備工藝解決方案北京北方華創(chuàng)微電子裝備有限公司副總裁 劉韶華14:30-14:55打造封測(cè)產(chǎn)業(yè)技術(shù)創(chuàng)新鏈，助推企業(yè)技術(shù)創(chuàng)新發(fā)展華進(jìn)半導(dǎo)體封裝先導(dǎo)技術(shù)研發(fā)中心有限公司總經(jīng)理 曹立強(qiáng) 主持人：中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)支撐業(yè)分會(huì)秘書長(zhǎng) 石 瑛14:55-15:20打造特色模擬工藝平臺(tái)，助力中國(guó)功率半導(dǎo)體發(fā)展無錫華潤(rùn)上華科技有限公司副總經(jīng)理邵 軍15:20-15:45新形勢(shì)下國(guó)內(nèi)電子化學(xué)材料的新格局電子氣體和電子濕化學(xué)品中巨芯科技有限公司總經(jīng)理 陳 剛

59、15:45-16:10加強(qiáng)產(chǎn)學(xué)研用合作，提高功率器件核心競(jìng)爭(zhēng)力西安衛(wèi)光科技有限公司副總經(jīng)理 白朝輝中英文分論壇四：集成電路產(chǎn)業(yè)鏈創(chuàng)新發(fā)展論壇Sub-Forum Four: Innovative Development of Integrated Circuit Industrial Chain主題：構(gòu)建技術(shù)創(chuàng)新鏈 提升產(chǎn)業(yè)競(jìng)爭(zhēng)力Theme: Built a Chain of Technological Innovation to Improve Industrial Competitiveness時(shí)間：2018年12月12日下午地點(diǎn)：上海浦東嘉里大酒店三層浦東宴會(huì)廳1-3承辦：中國(guó)半導(dǎo)體行業(yè)協(xié)

60、會(huì)集成電路分會(huì)、中國(guó)半導(dǎo)體行業(yè)協(xié)會(huì)支撐業(yè)分會(huì)Time: Afternoon, December 12, 2018Venue: Pudong Banquet Hall 1-3, third floor of Kerry Hotel Pudong ShanghaiOrganizer: Integrated Circuit Branch of China Semiconductor Industry Association, Supporting Industry of China Semiconductor Industry Association全英文：Sub-Forum Four: Innov