1、b eliminator ÆÁ¼«µçÔ´ÕûÁ÷back bias ·´Æ«Ñ¹back biased diode ·´Æ«¶þ¼«¹Üback bonding µ¹×°¼üºÏback contact ºó´

2、;¥µãback diffusion ·´ÏòÀ©É¢back edge Ͻµ±ßback end processing ºó¶Ë´¦Àíback gate mos ·´ÏòդƫÖýðÊôÑ

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4、195;æµç³¡back to back diodes ±³¶Ô±³¶þ¼«¹Üback wave ·µ²¨backboard ºóÃæ°åbackbonded chip µ¹×°Ð¾Æ¬backfill ·´Ì

5、38;³äbackfire Ä满background ±³¾°background color ±³¾°É«background control ±³¾°ÁÁ¶È¿ØÖÆbackground fade in ±³¾°µ­Èëbackgr

6、ound fade out ±³¾°µ­³öbackground limited photodetector ±³¾°ÏÞÖƹâµç¼ì²âÆ÷background noise ±³¾°ÔëÉùbackground noise suppression

7、77;³¾°ÔëÉùÒÖÖÆbackground radiation ±³¾°·øÉäbackground suppression ±³¾°ÔëÉùÒÖÖÆbackground wave »ù×¼²¨backing pumpe &

8、#199;°¼¶±Ãbackpanel ºóÃæ°åbackplane ºóÃæ°åbackscatter ±³ÃæÉ¢Éäbackscatter factor ±³ÃæÉ¢ÉäÒòÊýbackscattered radiatio

9、n ±³ÃæÉ¢Éä·øÉäbackside ±³Ãæbackup ´¢±¸backwall solar cell ºó±ÚÌ«Ñôµç³Øbackward conductance ·´Ïòµçµ¼b

10、ackward diode ·´Ïò¶þ¼«¹Übackward wave ·´Ïò²¨backward wave amplifier ·µ²¨·Å´óÆ÷backward wave oscillator »Ø²¨Õñµ´Æ÷backwar

11、d wave tube »Ø²¨¹Übacteria free water ÎÞ¾úË®bake ÈÈ´¦Àíbakeout ºæ¿¾balance ƽºâbalanced aerial ¶Ô³ÆÌìÏßbalanced amplifier Æ&#

12、189;ºâ·Å´óÆ÷balanced antenna ¶Ô³ÆÌìÏßbalanced cable ¶Ô³ÆµçÀÂbalanced circuit ƽºâµç·balanced input ¶Ô³ÆÊä

13、0;ëbalanced load ¶Ô³Æ¸ºÔØbalanced mixer ƽºâ»ìƵÆ÷balanced modulator ƽºâµÆÆ÷balanced oscillator ƽºâÕñµ´Æ÷balanced

14、 transformer ƽºâ±äѹÆ÷balanced unbalanced transformer ƽºâ ²»Æ½ºâ±ä»»Æ÷ball bond Çòº¸ball bonder ÇòÐκ¸½Ó

15、8;÷ball bonding Çòº¸ballast resistor ÕòÁç×èÆ÷ballast tube ÕòÁÜballistic heterostructure µ¯µÀÒìÖʽṹballistic transistor µ¯µÀ¾

16、7;Ìå¹Üballistic transport µ¯µÀ´«µÝballometry ÎíÁ£µçºÉ²â¶¨·¨balls down chip ÇòÐÎÒýÏßµ¹×°Ð¾Æ¬

17、;balun ƽºâ ²»Æ½ºâ±ä»»Æ÷banana plug Ï㽶²åÍ·band ´øband bending ÄÜ´øÍäÇúband crossing ÄÜ´øÏà½&#

18、187;band edge ´ø±ßÑØband edge curvature ÄÜ´ø±ßÔµÍäÇúband elimination filter ´ø×èÂ˲¨Æ÷band gap ÄÜ´ø϶band gap narrowing ½

19、1;´øÊÕËõband limits Ƶ´øÏÞÖÆband pass ͨ´øband pass amplifier ´øͨ·Å´óÆ÷band pass crystal filter ´øͨ¾§ÌåÂË

20、78;¨Æ÷band pass filter ´øͨÂ˲¨Æ÷band reject filter ´ø×èÂ˲¨Æ÷Ƶ´øÕ¹¾õϵÊýband scheme ÄÜ´øͼ

21、02;½band sharing Ƶ´ø¹²ÓÃband stop filter ´ø×èÂ˲¨Æ÷Ƶ´øÕ¹¾õϵÊýband structure ÄÜ´ø½á¹¹band to band trans

22、ition ´ø¼äԾǨbandspread Ƶ´øÕ¹¿íbandwidth ´ø¿íbantam tube СÐ͹Übare board ¿Õ°åbare chip ÂãƬbare hybrid Âã¶

23、»ìºÏµç·bare semiconductor Â㶰뵼Ìåbaritt diode ÊÆÀÝ×¢Èë¶ÉԽʱ¼ä¶þ¼«¹Übaritt oscillator Ê

24、8;ÀÝ×¢Èë¶ÉԽʱ¼ä¶þ¼«¹ÜÕñµ´Æ÷barium ±µbarrage jamming ×èÈû¸ÉÈÅbarrel distortion Í°ÐÎʧÕ

25、;æbarrel reactor plasma etching ԲͲÐη´Ó¦ÆÚµÈÀë×Ó¸¯Ê´barrel type reactor ԲͲÐη´Ó¦Æ÷barretter ÎÈÁÜbarri

26、er ÊÆÀÝbarrier capacitance ×èµ²²ãµçÈÝbarrier height ÊÆÀݸ߶Èbarrier junction ÊÆÀݽábarrier layer ×èµ²²ãbarrier layer rectifier

27、89;áÐÍÕûÁ÷barrier potential ÊÆÀݵçλbarrier type ccd ÊÆÀÝÐ͵çºÉñîºÏÆþbase »ù¼«base bias »ù¼«Æ«&

28、#209;¹base centered lattice µ×Ðľ§¸ñbase collector junction »ù¼«¼¯µç¼«½Õbase current »ù¼«µçÁ÷base diffusion »ù¼«À©É¢

29、;base diffusion isolation »ù¼«À©É¢¸ôÀëbase diffusion window »ù¼«À©É¢´°base electrode »ùÇøµç¼«base emitter diode »ù¼«·¢&#

30、201;伫¶þ¼«¹Übase emitter junction »ù¼«·¢É伫½ábase impurity »ùÇøÔÓÖÊbase insert ÒþÂñ»ù¼«base lifetime »ù

31、ÇøÔØÁÓÊÙÃübase material »ùÌå²ÄÁÏbase metal cermet ¼ú½ðÊôÌÕ´Ébase metal paste ¼ú½ðÊô¸àbase metal resistor ¼ú

32、89;ðÊôµç×èbase region mask »ùÇøÐγÉÑÚÄ£base ring »ùÇø»·base sidewall »ù¼«²à±Úbaseband »ù´øbaseband signal »

33、49;´øÐźÅbasic approach »ù±¾·½·¨basic building block »ù±¾¹¹¼þbasic circuit »ù±¾µç·basic group »ù±¾Èºbasic process »

34、;ù×¼¹¤ÒÕbasic technology »ù±¾¹¤ÒÕbass boosting circuit µÍÒôÔöÇ¿µç·bat wing antenna òùòðÒíÌìÏßbatch Ò»

35、97;úbatch bonding ³ÉÅúº¸½Óbatch etching ³ÉÅú¸¯Ê´batch fabrication ³ÉÅúÉú²úbatch method ·ÖÅú´¦Àí·¨batch operation ·Ö

36、Åú²Ù×÷baud ²¨ÌØbaudot code ²©ÌõÂëbaw ÌåÉù²¨bbb »ù±¾¹¹¼þbbd ¶·Á´Ê½Æþbbsr ¶·Á´Ê½&#

37、210;Æλ¼Ä´æÆ÷bc cut quartz bc ½Ø¸îʯӢƬbccd Âñ¹µµçºÉñîºÏÆþbcmos Âñ¹µ½ðÊôÑõ»

38、5;Îï°ëµ¼Ìåbdi »ù¼«À©É¢¸ôÀëbeacon ÐűêµÆËþbeacon approach ÐűêÒýµ¼½ø³¡beacon course ÎÞÏ

39、;ߵ絼±êµÄº½Ïßbeam ¹âÊøbeam alignment ÉäÊøµûbeam antenna ¶¨ÏòÌìÏßbeam aperture ÉäÊø¿×¾¶beam attenuation &

40、#202;øË¥¼õbeam axis ÉäÊøÖábeam charge neutralization ÉäÊøµçºÉÖкÍbeam collimation ÊøÁ¼Ö±beam convergence ÉäÊø»á¾Ûbe

41、am coupling µç×ÓÊøñîºÏbeam cross section ÊøÁØÃæbeam crystallized polysilicon ÉäÊø½á¾§µÄ¶à¾§¹èbeam current ÉäÊøµ

42、1;Á÷ÊøµçÁ÷µç×ÓÊøµçÁ÷beam deflection ÉäÊøƫתbeam deflection tube ÉäÊøƫת¹Übeam density ÊøÁܶ&#

43、200;beam diameter ÊøÁ±¾¶beam divergence ÉäÊø·¢É¢beam divergence angle ÊøÁ¢É¢½Çbeam divider ÉäÊø·ÖÀëÆ÷beam dividing ÉäÊø&

44、#183;Ö¸îbeam division ÉäÊø·Ö¸îbeam energy ÉäÊøÄÜÁ¿beam focusing Êø¾Û½¹beam jitter Êø°Ú¶¯beam lead ÁºÊ½ÒýÏß

45、;beam lead assembly ÁºÊ½ÒýÏß×é¼þbeam lead bonding ÁºÊ½ÒýÏß¼üºÏbeam lead chip ÁºÊ½ÒýÏßоƬbeam lead crossover Áº

46、;ʽÒýÏß½»²æbeam lead device ÁºÊ½ÒýÏßÆþbeam lead integrated circuit ÁºÊ½ÒýÏß¼¯³Éµç·beam lead isolation ÁºÊ

47、;½ÒýÏ߸ôÀëbeam matching ÊøÁ¥Åäbeam modulation ÉäÊøµÆbeam monitoring ÊøÁà²âbeam of particles Á£×ÓÊøbeam path Êø·

48、90;¶beam phasing ÉäÊøÏàλµûbeam positioner µç×ÓÊøλÖÿØÖÆÆ÷beam power tube ÊøÉ书ÂʹÜbeam power valve Êø&

49、#201;书ÂʹÜbeam processing µç×ÓÊø¼Ó¹¤beam propagation ¹âÊø´«²¥beam propagation path ¹âÊø´«²¥¹ì¼£beam rider missile

50、 ¼ÝÊøʽµ¼µ¯beam riding missile ¼ÝÊøʽµ¼µ¯beam scanning ÊøɨÃèbeam self focusing ÉäÊø×Ô¾Û½¹beam shape ÉäÊ&

51、#248;ÐÎ×´beam shaping ÉäÊø³ÉÐÎbeam splitter ¹âÊø·ÖÀëÆ÷beam splitter mirror ¹âÊø·ÖÁѾµbeam splitting Êø·ÖÁÑbeam

52、 splitting reflector ¹âÊø·ÖÀë·´ÉäÆ÷beam spot µç×ÓÊø¹âµãbeam spreading ÊøÉ¢beam stabilization ÉäÊøÎȶ¨beam switching 

53、1;äÊøת»»beam switching tube ÉäÊø¿ª¹Ø¹Übeam tape automated assembly ÁºÊ½ÒýÏß´ø×Ô¶¯×é×°beam tape automated bonder Áº

54、ʽÒýÏß´ø×Ô¶¯º¸½ÓÆ÷beam tape packaging ÁºÊ½ÒýÏß´ø·â×°beam tape technology ÁºÊ½ÒýÏß´ø×&

55、#233;×°¼¼Êõbeam tetrode µç×ÓÊøËļ«¹Übeamwriter µç×ÓÊøÃèͼװÖÃbeamwriter lithography µç×ÓÊø¹â¿&#

56、204;bearing ·½Î»bearing error ·½Î»Îó²îbearing zone ²âÏòÇøbeat frequency ÅÄƵbeat frequency oscillator ÅÄƵÕñµ´Æ÷beat frequency receiver 

57、7;ÄƵ½ÓÊÕ»úbeats ²îÅÄÕñ¶¯bef ´ø×èÂ˲¨Æ÷Ƶ´øÕ¹¾õϵÊýbell jar ÖÓÐÎÕÖbellows &

58、#178;¨ÎƹÜbellows joint ²¨ÎƹÜÁ¬½Óbelt feed ´øʽ½øÁÏbelt feeder ´øʽ½øÁÏÆ÷belt furnace ´øʽ¯bench ¹

59、¤×¨bend ÍäÇúbend coupling ÍäÇúñîºÏbent aerial ÇúÕÛÌìÏßbent antenna ÇúÕÛÌìÏßbent lightguide ÍäÇú¹â²¨µ

60、¼bent rhombic antenna ÇúÕÛÁâÐÎÌìÏßber ±ÈÌØÎó²îÂÊberyllia Ñõ»¯îëberyllium îëberyllium ceramics Ñõ»¯îëÌÕ

61、80;Ébeta current gain µçÁöÒæbeta degradation ÖµµÝ½µbeta radiation Ïß·øÉäbeta tolerance ÄÍÉäÏßÐÔbetatron µç×Ó¸ÐÓ¦¼Ó&

62、#203;ÙÆ÷betatron frequency µç×Ó¸ÐÓ¦¼ÓËÙƵÂÊbetatron orbit µç×Ó¸ÐÓ¦¼ÓËÙÆìµÀbetatron oscillations µç×Ó¸

63、;ÐÓ¦¼ÓËÙÆñµ´bevatron ¸ßÄÜÖÊ×Óͬ²½ÎÈÏò¼ÓËÙÆ÷beverage aerial Ðв¨ÌìÏßbeverage antenna ±´

64、;·ð²ËÈÕÌìÏßbfo ÅÄƵÕñµ´Æ÷bi etching system Ë«Öظ¯Ê´×°ÖÃbi fet amplifier Ë«¼« ³¡Ð§Ó¦¾&

65、#167;Ìå¹Ü·Å´óÆ÷bi level structure Ë«µçƽ½á¹¹bias Æ«ÖÃbias battery ƫѹµç³Øbias current ƫѹµçÁ÷bias

66、distortion Æ«ÒÆʧÕæbias heat treatment ¼ÓƫѹÈÈ´¦Àíbias noise ƫѹÔëÉùbias sputtering ƫѹ½¦Éäbias voltage Æ«&

67、#209;¹biasing characteristic ¿ØÖÆÌØÐÔbiasing current ƫѹµçÁ÷biconical antenna ˫׶ÐÎÌìÏßbiconical horn ˫׶ÐÎÀ®°Èb

68、idirectional coupler Ë«ÏòñîºÏÆ÷bidirectional transducer Ë«Ïòת»»Æ÷Ë«Ïò´«¸ÐÆ÷bifet Ë«¼«½áÐͳ¡Ð&#

69、167;Ó¦¾§Ìå¹Ü¹¤ÒÕbifilar helix Ë«¹ÉÂÝÐýbifurcation ·Öáªbigfet Ë«¼« ¾øÔµÕ¤³¡Ð§Ó¦¾§Ì

70、9;¹Ü¼¯³Éµç·bilateral Ë«±ßµÄbilateral antenna Ë«ÏòÌìÏßbilateral area track Ë«±ßÃæ»ýµÆÉùµÀbilateral switch 

71、3;«Ïò¿ª¹Øbillboard array ƽÃæ·´ÉäƬÏà¶àÕñ×ÓÌìÏßbillet ¾§¶§billibit ǧÕ×λbimatron µç×Ó

72、;Êø×¢Èë´Å¿Ø¹Übimetal mask Ë«½ðÊôÑÚÄ£bimos Ë«¼«½ðÊôÑõ»¯Îï°ëµ¼Ìå¼¼Êõbina

73、ry counter ¶þ½øÖƼÆÊýÆ÷binary data ¶þ½øÖÆÊý¾Ýbinary digit ¶þ½øÖÆÊý×Öbinary divider ¶þ½øÖƼÆÊ

74、53;Æ÷binary flip flop ¶þ½øÖÆ´¥·¢Æ÷binary information ¶þ½øÖÆÐÅÏ¢binary logic gate ¶þ½øÖÆÂß¼­Ãŵç·bin

75、ary number ¶þ½øλÊýbinary scaler ¶þ½øÖƼÆÊýÆ÷binary signal ¶þ½øÖÆÐźÅbinary unit ¶þ½øÖƵ¥Î»binder &#

76、213;³ºÏ¼Ábinding agent Õ³ºÏ¼Ábiologic solar cell ÉúÎïÌ«ÑôÄܵç³Øbiological integrated circuit ÉúÎï·Ö×Ó¼¯³Éµ

77、1;·biomagnetism ÉúÎï´ÅÐÔbionical horn ˫Բ׶ÐÎÀ®°Èbipolar approach Ë«¼«Ðͼ¼Êõbipolar array Ë«¼«ÐÍÕó

78、ÁÐbipolar bit slice Ë«¼«ÐÍλƬ΢´¦Àí»úbipolar cell Ë«¼«µ¥Ôªbipolar chip Ë«¼«¼¯³Éµç·bipolar design &

79、#203;«¼«Éè¼Æbipolar driver Ë«¼«Çý¶¯Æ÷bipolar fet integrated circuit Ë«¼« ³¡Ð§Ó¦¾§Ìå¹Ü¼¯³Éµç·bi

80、polar filter Ë«¼«ÐÍÂ˲¨Æ÷bipolar input Ë«¼«ÐÍÊäÈëbipolar insulated gate fet ic Ë«¼« ¾øÔµÕ¤³¡Ð§Ó¦¾§&#

81、204;å¹Ü¼¯³Éµç·bipolar integrated circuit Ë«¼«¼¯³Éµç·bipolar ion implantation Ë«¼«ÐÍÆþÓÃÀë×Ó×¢È

82、5;bipolar isolation Ë«¼«¼¯³Éµç·µ¥Ôª¸ôÀëbipolar junction fet technology Ë«¼«½áÐͳ¡Ð§Ó¦¾§Ìå¹Ü¹&#

83、164;ÒÕbipolar logic Ë«¼«ÐÍÂß¼­bipolar mos device Ë«¼«½ðÊôÑõ»¯Îï°ëµ¼ÌåÆþbipolar mos technology Ë«¼«½ð

84、ÊôÑõ»¯Îï°ëµ¼Ìå¼¼Êõbipolar operation Ë«¼«ÐͶ¯×÷bipolar performance Ë«¼«ÐÍÌØÐÔbipolar process Ë«¼

85、«¹¤ÒÕbipolar sample hold Ë«¼«ÐÍÈ¡Ñù±£³Ö¼¯³Éµç·bipolar speed Ë«¼«¼¯³Éµç·ËÙ¶Èbipolar

86、transistor Ë«¼«ÐÔ¾§Ìå¹Übipolar wafer Ë«¼«Ð;§Æ¬bird's beak bonding Äñ×ìÐμüºÏ·¨birefringence Ë«ÕÛÉ

87、28;bisignal zone µÈÇ¿ÐźÅÇøbismuth îébistability Ë«Îȶ¨ÐÔbistable Ë«Îȶ¨µÄbistable circuit Ë«Îȵç·bistable laser Ë

88、«ÎÈ̬¼¤¹âÆ÷bistable multivibrator Ë«ÎÈ̬¶àгÕñµ´Æ÷bistable operation Ë«ÎÈ̬¹¤×÷bistable optical device Ë«

89、ÎÈ̬¹âѧÆþbistable unit Ë«ÎÈ̬²¿¼þbit ±ÈÌØbit error rate ±ÈÌØÎó²îÂÊbit error ratio ±ÈÌØÎó²î

90、;ÂÊbit rate λËÙÂÊbit slice λƬbit slice architecture λƬ½á¹¹bit slice microprocessor λƬbit synchronization ±ÈÌØͬ²½bits per second 

91、6;»Ãëblack and white channel ºÚ°×ͨµÀblack and white holography ºÚ°×È«Ï¢ÕÕÏàÊõblack and white picture ºÚ°×ͼÏóblack and white televisio

92、n ºÚ°×µçÊÓblack body ºÚÌåblack body radiation ºÚÌå·øÉäblack clipping ºÚÉ«µçƽÏÞ·ùblack content ºÚÉ«º¬Á

93、91;black level ºÚÉ«µçƽblack level clamping ºÚµçƽóéλblack level shift ºÚµçƽƫÒÆblack out ϨÃðblack out level ϨÃð

94、1;çƽblack out of video signals ÊÓƵÐźÅϨÃðblack out pulse ϨÃðÂö³åblack out signal ϨÃðÐźÅblack peak ºÚÉ«·åÖ

95、;µblack reference level ºÚÉ«»ù×¼µçƽblack saturation ºÚÉ«±¥ºÍblack signal ºÚÐźÅblack stretch ºÚÉ«ÐźÅÕ¹¿í

96、;black to white amplitude range ºÚ°×¼äÕñ·ù¿í¶Èblack to white frequency swing ºÚ°×¼äƵÂʲîblack white monitor ºÚ°×ͼÏó¼à&

97、#191;Ø×°ÖÃblade µ¶Æ¬blank ±í¸ñblank groove δµ÷ÎÆÎÞÉù²Ûblank plate ä°åblanked videosignal ÏûÒþÊÓƵÐÅ

98、6;Åblanket diffusion È«ÃæÀ©É¢blanket exposure È«ÃæÆعâblanking ϨÃðblanking amplifier ÏûÒþÂö³å·Å´óÆ÷blanking circuit Ï&#

99、251;Òþµç·blanking level ÏûÒþµçƽblanking pulse ϨÃðÂö³åblanking signal ÏûÒþÐźÅbld ÁºÊ½ÒýÏßÆþbleach

100、ed hologram Ư°×µÄȫϢͼbleeding Ä£ºý²»Çåblemish ÎÛ¼£blind approach äĿ½ø³¡blind area ¾²Çøblind bonding ×Ô

101、82;¯ÈÈѹº¸blind sector Ó©¹âÆÁÒõÓ°Çøblind zone ¾²Çøblinker light ÉÁ¹âÐÅÉÁblip ¼âÍ·ÐźÅblister Ìì

102、ÏßÆÁ±ÎÆ÷À×´ïÌìÏßÕÖbloating ÅòÕÍblock antenna ¹²ÓÃÌìÏßblock condenser ¸ôÁçÈÝÆ÷×èÈûµ

103、31;ÈÝÆ÷block construction ²¿¼þ½á¹¹block level ·âËøµçƽblock level design »ýľ¿é¼¶Éè¼Æblock replicate approach µ¥ÔªÖ

104、ظ´·½·¨blocking ×èÈûblocking capacitor ¸ôÁçÈÝÆ÷×èÈûµçÈÝÆ÷blocking condenser ¸ôÁçÈÝÆ÷×èÈûµ&

105、#231;ÈÝÆ÷blocking junction ×èµ²½áblocking layer ×èµ²²ãblocking mask ÆÁ±ÎÑÚÄ£blocking oscillator ¼äЪÕñµ´Æ÷blocking resistance 

106、5;èÈûµç×èblocking signal ±ÕËøÐźÅblocking voltage ±ÕËøµçѹblooming Ä£ºýÏÖÏóblue adder À¶É«¼Ó·¨Æ÷

107、;blue beam À¶µç×ÓÊøblue black level À¶Â·ºÚµçƽblue color difference modulator b yµÆÆ÷blue color difference signal b yÐźÅblue convergence circuit À¶»á

108、¾Ûµç·blue gain control À¶É«ÔöÒæµÚblue modulator À¶É«ÐźŵÆÆ÷blue peak level À¶ÐźŷåÖµµçƽ

109、;blue shift À¶ÏòÒÆλblue video voltage À¶É«ÊÓƵµçѹblurred image Ä£ºýͼÏóblurring Ä£ºý²»Çåbmos ·´Ïò&

110、#213;¤Æ«ÖýðÊôÑõ»¯Îï°ëµ¼Ìåbn source µª»¯ÅðÀ©É¢Ô´board °åboard radio station ´¬ÄÚÎÞÏß&

111、#181;ç̨boat СÖÛboat evaporator СÖÛʽÕô·¢Æ÷body centred cubic lattice ÌåÐÄÁ¢·½¾§¸ñbody centred lattice ÌåÐľ§

112、4;ñbody centred orthorhombic lattice ÌåÐÄб·½¾§¸ñbody effect ³Äµ×ЧӦbolcking condenser źºÏµçÈÝÆ÷bolometer ·øÉäÈÈ&

113、#188;Æbolometer mount ÈÈ·øÉä¼ÆÖ§¼Übombardment ºä»÷bombardment by ions Àë×Óºä»÷Àë×Ó³å»÷bombardment induced conductivity ÓÉ

114、1;ç×Óºä»ýÖµĵ絼bombardment of electrons µç×Óºä»÷bond ÈÈѹº¸½Óbond failure ½áºÏËð»µbond interface º

115、¸½Ó½çÃæbond lift off ¼üºÏ´¦°þÀëbond pad definition º¸ÅÌͼÏóÐγÉbond peel ¼üºÏ´¦°þÀëbond pull test ¼&

116、#252;ºÏÇ£ÒýÊÔÑébond sequence ¼üºÏ¹¤Ðòbond strength Õ³ºÏÇ¿¶Èbonder ÈÈѹº¸½Ó»úbonder capillary º¸½Ó

117、98;Äëϸ¹Übonding º¸½Óbonding adhesive оƬ¼üºÏÓÃÕ³ºÏ¼Ábonding agent Õ³ºÏ¼Ábonding area º¸½ÓÇøbonding cyc

118、le º¸½ÓÖÜÆÚbonding fixture º¸½Ó¼Ð¾ßbonding layer Õ³ºÏ²ãbonding lead º¸½ÓÒýÏßbonding machine ÈÈѹº¸½Ó»

119、0;bonding pad º¸ÅÌbonding speed º¸½ÓËÙÂÊbonding technique º¸½Ó¼¼Êõbonding tip º¸Í·bonding wire º¸Ïßbonding wire connection º¸ÏßÁ¬&

120、#189;Óbooster ¹â·Å´óÆ÷booster amplifier ¸¨Öú·Å´óÆ÷booster diode Éýѹ¶þ¼«¹Übooster pump Ôöѹ±Ãbooster transmitter ¸¨

121、Öú·¢Éä»úbootstrap amplifier ×ÔÒæ·Å´óÆ÷bootstrap circuit ×Ô¾Ùµç·bootstrapping ×Ô¾Ùµç·boron Åðboron base ²ô

122、97;ð»ù¼«boron depletion ²ôÅðºÄ¾¡boron diffusion ÅðÀ©É¢boron doping ²ôÅðboron implantation ÅðÀë×Ó×¢Èëboron implanted silicon ×¢

123、;Åð¹èboron nitride pellicle µª»¯Åð±¡Ä¤boron semiconductor ²ôÅð°ëµ¼Ìåborosilicate glass Åð¹è²£Á§bottom of conduction band µ¼´&

124、#248;µ×bottomside mark µ×Ãæ±ê¼Çboule ¾§¶§boule ruby ºì±¦Ê¯À澧bounce ±êÖ¾´óСµÄÌø¶¯bouncing motion ͼ

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