1、*目錄*項目ITEM頁次PAGE目1修2132.33.3445565-207208.20-30內 容 DESCRIPTION訂履歷目的范圍參考文件定義職責環境管理物質的規定文件變更時機及權限附加文槽*修訂履歷*版次REV.ECN NO.修訂履歷Revise History備注RemarkABC-02-54514新版發行 (Issued first time)1、目的 Purpose:本規定主要是針對 NWInG （以下簡稱本公司）相關客戶環境要求之產品 及材料等中所含的環境管理物質，明確禁止使用物質，計劃廢除物質以及削減物質，期讓公司內部及供應商人人 皆知，達到防止向客戶產品混入環境有害物質，

2、提高本公司產品的環境質量及產品的競爭力及遵守法令，保護地球環境以及減輕對生態系統影響的目的.This Regulation mainly focus on the Environment-related substances to be controlled （"The Controlled Substances ”）contained in the products and materials required by relatedcustomers of Foxconn NWInG, Clarified the banned substance, substances to be

3、 phased out and substances to be reduced, weexpected the regulation can be forwarded to companyinterior and suppliers to prevent the above-mentioned substances from being used for customers. Improve the environmentquality and competition of product to comply with related lawsand regulations. To redu

4、ce the influence of the above-mentioned substance upon the ecosystem and contribute tothe global environmental preservation.2、范圍 Scope:2.1 成品和半成品（功能單元，模塊，板組件等的組裝零件等）Finished products and semi-finished products （e.g. modules, functional units, board assemblies, and other parts etc.）2.2 零件（電氣零件，機構零件，半

5、導體產品，印刷電路板，記錄介質，包 裝材料，包裝零件）Parts （electrical parts, mechanical parts, semiconductor devices, PWBs, recording media, packaging materials, packaging parts）2.3 螺絲 Screws2.4 附件（遙控器，鼠標,AC適配器等為設備使用而配套的附屬品等）Accessories （remote controllers, mice, ACadaptors and other accessories）2.5 產品所使用的附屬材料（膠帶，焊接材料，粘結劑等）

6、等構成材料 Materials employed in subsidiary parts and materials usedfor products （adhesive, soldering materials, adhesive tapes）2.6 操作說明書 Instruction manuals2.7 服務零件 Repair parts2.8 產品交貨時發送和保護貨物所使用的包裝材料（木框，托架，導軌,杠桿，袋，緩沖材料，固定器具，薄板，繩索，硬紙箱，膠帶，捆綁帶，標簽，印刷油墨及涂料等）The packaging materials used for delivery and pro

7、tection products (wooden frames, trays, reels, sticks, bags, cushions, staples, sheets wraps, tapes, labels, corrugated cardboard, vinyl ties, and inks or paints for printing)備注：止匕外，在本文件中未明確規定的物質或其用途，如果各國，當地法令或相關客戶禁止使用或限制使用，必須按照其要求執行.Remark: Regarding the substances or their purpose whose use is ban

8、ned by regional or country or related customerslaws and ordinances, the laws and ordinances must be observed even though the substances or their purposeare not clearly regulated in this document.3、參考文件 Reference:3.1 Sony SS-00259技術標準(第2版)Sony SS-00259 Technical Standards (Rev: 2)3.2 環境管理物質管制及異常處理程序(

9、SG-2B0-016)The Controlled Substances Management & Deviation Handling Procedure4、正義 Definition4.1 環境管理物質 Environment-related Substances to beControlled ("The Controlled Substances ”)客戶及本公司判斷在產品，設備等所含有的物質中,有對地球環 境和人體存在顯著影響的物質.The substances contained in products or materials judged byFoxconn

10、or customers that they obviously impact on both humans and global environment.4.2 管理級別：Management Standards按照以下3種管理級別進行管理To managethe above-mentioned substances, the following three levels are used.4.2.1 1 級：對于該物質及其用途立即禁止使用.Level 1: The substances and purposes classified at this level are those whos

11、e use must be banned immediately.4.2.2 2 級：對于該物質及其用途規定一定時期予以禁止.超過表中規定的日期之后，不能在產品及材料中使用，到達期限時指定為“1級”Level 2: The substances and purposes classified at this level are those for which periods for phased out are individually set. After the time set in each table, the substance fulfilling the above condi

12、tion will be classified at level one and must not be contained in parts and materials.4.2.3 3級：目前雖然沒有規定日期以及削減目標，但指定了計劃削減在產品，材料中含量的物質及其用途.Level 3: No periods or targets for reduction are currently set for the substances and purposes classified at this level. However, the contents in products and mate

13、rials ought to be reduced.4.3 含有 Contained含有系指無論是否有意，所有在產品的零件，設備或使用的材料中添 力口，填充，混入或黏附的物質(包括在加工過 強中無意混入乎黏附于產品中的物質)"Contained " is a situation in which a substance is added to, fills up, mingles with or adheres to the parts ordevices employed in products, the materials used for the parts or d

14、evices, regardless if the situation isintentionally created or not. (When a substances is unintentionally contained in, or added to a product in a processing process, this is also regarded as"Contained ”)4.4 雜質 Impurity包含在天然材料中，作為工業材料使用，在精制過程中技術上不能完 全去除的物質(natural impurity),或者合成反應過程中產生，而在技術上不能完

15、全去除的物質.A substance contained in a natural material, which cannot technically be removed in a refining process totally, or a substance generated in a synthesis process, the total removal of which is technically impossible.此外，為了與主原料加以區別，在為了改變材料的特性而使用稱之 為“雜質”的物質時，也按“含有”處理.但是，在制造半導體產品等 使用的摻雜劑(DOPANT),雖然

16、是有意添加的，但實質上在半導體產品 中僅有極微量殘存，這種情況下不作為“含有”處理 .,Additionally, there are substances calledaimpurity ” , thename of which is used to distinguish them from main materials. If they are used for the purpose of changing the characteristics of materials, they are treated as “ Contained ” . There are substances

17、 called Dopants (Doping Agents) that are intentionally added to manufacture semiconductor devices. They are not treated as "Contained " if left in the devices in a very small amount.在本規定中,在指定允許濃度的情況下，當在產品或材料中該環境管 理物質作為雜質混入或者黏附時，其濃度不應超過該允許濃度.“When an allowable concentration of an “ Environm

18、ent -related Substances to be Controlled " is specified in this management regulation, the concentration must be kept even if the substance, as an aImpurity ” , mingles with or adheres to products or materials.4.5 禁止供貨時期 The time to ban on receiving the parts and materials.產品和材料禁止向客戶和Foxconn供貨日

19、t期(即客戶和Foxconn收貨之日期).This indicates the time when customers and Foxconn must not receive the parts and /or materials specified in this rule5、職責 Responsibilities:參見環境管理物質管制及異常處理程序Refer toThe Controlled Substances Management & Deviation Handling Procedure6、環境管理物質的管理標準Management standards for the c

20、ontrolledsubstances1.1 環境管理物質：本規定中作為對象的環境管理物質名稱見表6.1Environment-related Substances to be Controlled( "TheControlled Substances " ): refer to table 6.1 of“List of“ Environment - related substances to be controlled ”regulated in this regulation.表6.1環境管理物質名稱一覽表Table 6.1 List of Environment-re

21、lated Substances to be Controlled ("The Controlled Substances ”)物質名稱Substances11重金屬Heavy metals鎘及鎘化合物 Cadmium and cadmium compounds鉛及鉛化合物 Lead and lead compounds汞及汞化合物 Mercury and mercury compounds六價銘化合物 Hexavalent chromium compounds有機氯化合物Chlorinated organic compounds多氯聯苯 Polychlorinated biphen

22、yls (PCB)多氯化奈 Polychlorinated naphthalene (PCN)氯代烷燒 Chlorinated paraffin (CP)滅蟻靈 Mirex (Perchordecone)其它 有機 氯化 合物 Other chlorinated organic compounds有機澳化合物 Organicbrominated compound多澳聯苯(PBB) Polybrominated biphenyls多澳二聯苯 Polybrominated diphenylethers (PBDE)澳雙酚-A-雙-(2,3-二澳丙醍)Tetrabromobisphenol-A-bi

23、s-(2,3-dibromopro pylether) ( TBBP-A-bis)其它有機澳化合物Other brominated organiccompounds有機錫化合物(二丁基錫化合物，二苯基錫化合物 Organic tin compounds (Tributyl tin compounds, Triphenyl tin compounds)石棉 Asbestos偶氮化合物 Azo compounds甲醛 Formaldehyde聚氯乙烯(PVC)以及聚氯乙烯化合物Polyvinyl (PVC) and PVCblends1.2 環境管理物質主要對象及禁止供貨日期Main “Targe

24、ts ” and “The time to ban on receiving the parts and materials “ regarding The Controlled Substances ”物名耦：第以及輻化合物Substances:Cadmium and Cadmium compounds明：金腐，合金，輾械化合物，有械化合物，輾械蜜，有械蜜等含有第元素的所有物冽象甄圉All metals, alloys, inorganic compounds, metal-organic compounds, inorganic salts, organic salts, and othe

25、r substances封象 Targets禁止供SO寺期The time to ban on Receiving the parts and materials僦Level 1* 包裝崖品（參照表6.3a）（把手，塑料袋,余箱索，箔，托架,溥< ,W>盒等）;* 塑料（包括橡夥）材料中使用的穩定剜,m料，染料（H氟速的，遙控 器維 飆等啼 意子崖品的外裝榭脂，外框，黑！，唱片等）;* 壅料，墨水* 表面虞理（霞艘等）,w，照片;* 日光燎（小型日光燎，直管日光燎）;-Packaging materials （Refer to table 6.3a）（e.g. handles, c

26、ushions, wraps, foil, trays, reels, sticks, magazines and polyethylene bags;-The stabilizers, pigments, or dyes used for plastics （including rubber） materials （e.g. labels, cabinets, phonograph records, vinyl ties, the keys of remote controllers, the outer plastics resins of electrical parts, and th

27、e insulators of electrical wiring）-Paints, inks;-Surface treatment （e.g. plating）, coating; Photographic films;-Fluorescent lamps （small-sized ones, straight-tube ones）;立即孰行Banned immediately2級在H隨雷池中作得新型！品而供貨的材料，但所有的H 牖雷池優2004年11月始符禁止供貨;The Nickel and NiCd batteries that are received as new parts,Al

28、l the Nickel and NiCd batteries must not be used in or after November 2004優2003年2月1日鼠始On and after February 1, 20033級以外的所有用途.例如，直流重勤械，信昌,畿霜器，斷路器等重接黑占；溫度保陂的可溶醴;玻璃以及玻璃壅料的!料，染料（用於玻璃的!料，染料以及玻璃用壅料）;金旱金易（第含量懸20ppm以上的金旱金易）;螯光11示裝置中含有的螯光,CdS光醇霜池霜阻（玻璃料）等；注:辭屢金蠹件等金JS崖品中的輻，除了有意添加以外，符作卷親跳?不予理曾.優2004年11月1日融始2級Le

29、vel 23級Level 3All other purpose, which are not classified at Typical examples are given below:Level 3 ”-Switches, relays breakers, DC motors, and other electrical contact points;- Fuse elements of temperature fuses;- Glass, and the pigments and dyes of glass paints (paints for glass and the pigments

30、 and dyes used for glass);- Solder (whose cadmium concentration is 20 ppm or more);- CdS-photocells and the phosphors contained in fluorescent display devices;- Resistor elements (glass frit);Note): Cadmium contained in metal parts (e.g. zinc die-casting) is regarded as an impurity. Therefore, their

31、 cadmium concentration shall be disregarded unless cadmium is intentionally added to them.要求使用可靠性高的重接黑占而沒有替代材料的品The plating of electrical contacts, for which high reliability is required and which has no substitute materialsOn and after Novemberl, 2004允言包！度：小於5ppm,塑料（包括橡H ）Allowable concentration: L

32、ess than 5 ppm for plastics （including rubber）測定檄型:UM理：有皿前1理方法，探用硫酸，硝酸以及謾氧化氫存在下的?累式分解法（例如BS EN1122:2001" Plastics- Determination ofcadmium - Wet decomposition method中音已載的分解方法等），硫酸存在下的灰化法或者在密朗容器中的加IB酸分解法 （微波分解法）等.測定裝置檄型裝置卷感鷹等蹄子醴彝光分光分析裝置（ICP-MS）除以上之外，通imat理和測定裝置的合 以探用上述AAS以外的方法同日寺迤行分析（ICP-AES,ICP

33、-OES）,原子吸收裝置（AAS）,感鷹等蹄子till量分析裝置，如果可以保if第的定量下限懸5 ppm以下日寺劇作懸正品.此外，第和也可Standard for measurement:1) Pre-conditioningTypical examples are as follows:(1). A wet decomposition method under the existence of sulfuric acid, nitric acid, and hydrogen peroxide (e.g. the decomposition method specified in BS EN1

34、122:2001,Plastics-Determinatiowet decomposition method');(2) . An incineration method under the existence of sulfuric acid; and(3) . A pressurized acid decomposition method done in a sealed container (a microwave decomposition method).If precipitated are produced, dissolve them with some methods

35、.(2) Measurement methodUse any one of ICP-AES (OES)(Inductively Coupled Plasma-Atomic OpticalEmission Spectroscopy) or AAS (Atomic Absorption Spectroscopy), or ICP-MS (Inductively Coupled Plasma MassSpectroscopy).These are standard measurement methods.it is also availab-If a combination of pre-condi

36、tioning and a measurement method can guarantee that In this purpose, the lower determination limit of Cadmium is less than 5 ppm, Note: With the above-mentioned pre-conditioning and measurement method (expect AAS), it is possible to analyze cadmium and lead simultaneously.物名耦：以及化合物Substances: lead a

37、nd lead compounds明：金腐，合金，輾械化合物，有械化合物，輾械蜜，有械蜜等包含元素的所有物德1像甄圉All metals, alloys, inorganic compounds, metal-organic compounds, inorganic salts, organic salts, and other substances封象 Targets禁止供貨日寺期The time to ban on Receiving the parts and materials1級Level 1包裝材料(參照表6.3a)用於印刷fO各板而使用的料，1®料，墨水；Packagi

38、ng materials (Refer to table 6.3a)-Pigments, paints, and inks containing lead, which are used for PWBs;在小型密封池中作焉斫型®品而供K的崖品；The small-size -sealed lead-acid batteries that are received as new parts;立即孰行Banned immediately2級Level 2所有的小型密封池優2004年11月始禁止供貨All small-size sealed lead-acid batteries mus

39、t not be received in or after November 2004.徙2004年11月融始On and after November, 20042級Level 2*崖品的外部重趣，引醇端子等的冬旱金易慮理(重氟崖品/半醇醴崖品/散熱片等);*AC遹配器 重源霞，速接雷，遙控器，鼠檄，彳著外露部分中使用的塑料(包括橡W )材料中的穩定剜 X料，染料,壅料以及墨水-Soldering on the external electrodes and on the external lead wires of parts.(e.g. electrical parts, semicon

40、ductor devices, and heat sinks);-The stabilizers, pigments, dyes, paints, or inks contained in the plastics (including rubber) materials that are used for an outer and exposed part of the following articles: mice, devices, AC adaptors, connection cords, remote controllers, power supply cords, and th

41、e exposed parts of a device.優2004年2月1日鼠始On and after February 1, 20042級Level 23級以外的所有用途.例如，* 在85wt%以下的有金旱金易中，所含有的的含量在1000Ppm以上的厘品；* 光擘玻璃所含有的 ;* 含有允音翎1度*以上的各槿合金(包括金旱金!材料);* 除AC遹配器，重源，速接，遙控器，鼠檄，彳著外露部分以外所使用的塑料(包括橡 )材料中的穩定剜,m料，染料，料以及墨水All other purposes, which are not classified at“ Level 3 " ,typi

42、cbelow:* Among the type of leaded solder, the ones that satisfy both of the following conditions:(1) Leaded solder that contain less than 85wt% of lead; and(2) Leaded solder whose lead concentration is 1000 ppm or more.-Lead contained in optical glass-All kinds of alloys whose individual lead/lead c

43、ompounds concentrations exceedthe regulation (Refer to the table in" Level 3 ”)-The stabilizers, pigments, dyes, paints, and inks contained in the plastics(including rubber) materials that are used for articles other than mice, AC adaptors, connection cords, remote controllers power-supply cord

44、s, and the exposed parts of a device.al examples are given優2004年11月1日融始On and after November 1, 20043級Level 3崖品，lf的內部速接用高熔黑占蜉金易(能 85wt%以上的有蜉金易)* 子陶禽董品(屋重元件，陶瓷感鷹材料等)* 11像管，重子品，蟄光H示管所使用的玻璃材料；霜子品中使用的玻璃材料和密封材料，包括重阻醴,醇霜,，粘接剜，玻璃料等；* 含有的如下合金(*1)合金的槿含的允言鍍!度金同材0.35wt%以下金日合金0.4 wt%以下銅合金4 wt%以下金旱金易1000Ppm以下Hig

45、h-melting point solder for internal connections used for parts and devices (the leaded solder whose lead contents is at least 85wt%);- Electronic ceramic parts (e.g. piezoelectric elements, ceramic dielectric materials);- Glass materials used for electronic parts, cathode-ray tubes, or vacuum fluore

46、scent displays;- Glass materials used for electronic parts include sealing materials, resistor elements, conductive pastes, adhesives, and glass frit;- The following alloys that contain lead as an additive Type of alloyAllowable content of leadSteelLess than 0.35wt%Aluminum alloyLess than 0.4wt%Copp

47、er alloyLess than 4wt%SolderLess than 1000 ppm允言包1度:100ppm以下；塑料(包括橡fg )Allowable concentration: Less than 100 ppm for plastics and rubbers測定檄型:(1)頸慮理sot理方法探用硫酸，硝酸以及謾氧化氫存在下的潟式分解法，硫酸存在下的灰化法或者在密朗容器中的加屋酸分解法(微波分解法)等.在彝生沉物日寺使用某槿方法迤行溶解.(2)測定裝置檄型裝置懸感鷹等蹄子ft樊光分光分析裝置(ICP-AES,ICP-OES),原子吸收裝置(AAS),感鷹等蹄子till量分析裝置

48、(ICP-MS).通謾以上Shi理和測定裝置的合，如果可以保的定量下限懸30 ppm以下日寺，即作懸正品.此外，第和也可以探用上述AAS以外的方法同日寺迤行分析.Standard for measurement:1) Pre-conditioningTypical examples are as follows:(1) . A wet decomposition method under the existence of sulfuric acid, nitric acid, and hydrogen peroxide;(2) . An incineration method under th

49、e existence of sulfuric acid; and(3) . A pressurized acid decomposition method done in a sealed container (a microwave decomposition method);2) Measurement methodUse any one of ICP-AES(OES)(Inductively Coupled Plasma-Atomic Optical Emission Spectroscopy) or AAS (Atomic Absorption Spectroscopy), or I

50、CP-MS (Inductively Coupled Plasma Mass Spectroscopy). These are standard measurement methods.If a combination of pre-conditioning and a measurement method can guarantee that In this purpose, the lower determination limit of lead is less than 30 ppm, “ it is also available;Note: With the above-mentio

51、ned pre-conditioning and measurement method (expect AAS), it is possible to analyze cadmium and lead simultaneously.物名耦：汞以及汞化合物Substances: mercury and mercury compounds明：金腐，合金，輾械化合物，有械化合物，輾械蜜，有械蜜等包含汞元素的所有物冽象甄圉All metals, alloys, inorganic compounds, metal-organic compounds, inorganic salts, organic

52、salts, and other substances至勺象Targets禁止供SO寺期The time to ban on Receiving the parts and materials1級Level 1包裝材料(參照表6.3a)- m料淮料，墨水；- 汞重池，言十日寺器；- 小型日光燎(液晶背光燎等)，每一支的含量超謾10mg;- 直管日光燎，每一支的含量超謾20mg;- 使用汞作卷接黑占的畿霜器，信封，傅感器塑料中的添加剜.- Packaging materials (Refer to table 6.3a);- Pigments, paints, and inks-Mercury

53、cells, hour meters;- Small-sized fluorescent lamps (e.g. the ones for the back lights of liquid crystal displays),whose mercury content (per lamp) is more than 10 mg;- Straight-tube fluorescent lamps,whose mercury content (per lamp) is more than 20 mg;- The relays, switches, or sensors for which mer

54、cury is used in contacts;- Mercury or its compounds mixed in plastics.立即孰行Banned immediately2級Level 2* 小型日光燎，每一支的含量懸5mg以上10mg以下；* 直管日光燎，每一支的含量懸10mg以上20mg以下：* 氧化金艮霜池，性扣霜池，空氧霜池；* 1版和3級以外的所有用途.* All other purpose, which are not classified at Level 1 or 3;* Small-sized fluorescent lamps,whose mercury co

55、ntent (per lamp )is 5;* 10 mg-Straight-tube fluorescent lamps,whose mercury content (per lamp) is 10-20 mg;* Sliver oxide cells, alkaline-manganese cells, and air cells.優2004年11月1日融始 On and afterNovember 1,20043級Level 3* 小型日光燎，直管螯光燎以外的燎(高屋汞燎等)；* 小型日光燎：每一支的含量懸5mg以下；* 直管日光燎：每一支的含量懸10mg以下.* Lamps other

56、 than small-sized fluorescent lamps and straight-tube fluorescent lamps (e.g. High-pressure mercury lamp);* Small-sized fluorescent lamps,whose mercury content (per lamp) is less than 5mg;* Straight-tube fluorescent lamps,whose mercury content (per lamp) is less than 10mg.物!名H :六僵路化合物Substances: Hexvale