編者注：嚴(yán)格來(lái)說(shuō)下面展出的是制造業(yè)經(jīng)常用到的英文詞匯，一些專業(yè)的詞匯偏重于電子行業(yè)(SMT)，這些詞匯多以縮寫形式出現(xiàn)，另外，每個(gè)詞匯都給出了中文的意思和英文的解釋。所有詞匯按照A-Z的順序排序。·AEA美國(guó)電氣學(xué)會(huì)AmericanElectronicsAssociation.·AI自動(dòng)插件Auto-Insertion,amethod/equipmentusedtoproducepin-through-holecomponentstoPCboards.·APICS美國(guó)生產(chǎn)與庫(kù)存控制協(xié)會(huì)AmericanProductionandInventoryControlSociety.·ASIC專用集成電路ApplicationSpecificIntegratedCircuit.·ASICdesign專用集成電路設(shè)計(jì)Abilitytodesignanapplicationspecificintegratedcircuit(ASIC)chip.AnASICchipiscustomcustomdesignedforaspecificapplication,incontrasttoageneral-purposechipsuchasasamicroprocessor.·ASQC美國(guó)質(zhì)量控制學(xué)會(huì)AmericanSocietyforQualityControl.·ATE自動(dòng)測(cè)試設(shè)備AutomaticTestEquipment.·AVL已承認(rèn)供應(yīng)商列表ApprovedVendorList(partslist),partslistspecifyingapprovedmanufacturerandpartnumber.·Annularring銅箔Thecopperringaroundtheholeinaprintedcircuitboard.·B/I老化BurnIn,amethodusedtoscreenoutcomponentearlylifefailures.·BABT英國(guó)電信鑒定委員會(huì)BritishApprovalsBoardforTelecommunications.BABTapprovalisrequiredforalltelephonenetworkinterfacedequipmentsoldintheUnitedKingdom.·BCD二進(jìn)制編碼的十進(jìn)制BinaryCodedDecimal.·BOM物料清單Billofmaterials,thesourceofinformationofallcomponents.·BTO/Channelassembly按訂單生產(chǎn)Build-to-order,tobuildaunitfromcomponentleveltoanindividualorder,includingrequired.peripheralsandsoftware,andshipdirecttocustomer.Advantagesofbuild-to-order:reduced.inventorycosts,inparticular,nofinishedgoodsinventorytocarry.·Ball-gridarray球形陣列AmethodforattachingICstoaPCB.·Baudrate波特率Bitspersecond.Thespeedofdatatransmission.·Build-to-stock根據(jù)事前與客戶協(xié)議的庫(kù)存水平自動(dòng)補(bǔ)貨的一種交易模式Buildasignificantvolumeofunitsbaseduponahighlevelforecast,typicallyabaseunitorstandardconfiguration.ShiptoeitherOEMwarehouseordistributionwarehouse.·CAA計(jì)算機(jī)輔助裝配Computer-AidedAssembly.·CAD計(jì)算機(jī)輔助設(shè)計(jì)Computer-AidedDesign.·CAD/CAM計(jì)算機(jī)輔助制造Integrationofcomputer-aideddesignandmanufacturing.·CAE計(jì)算機(jī)輔助工程Computer-AidedEngineering.·CAF計(jì)算機(jī)輔助夾具Computer-AidedFixturing.·CAM計(jì)算機(jī)輔助制造Computer-AidedManufacturing.·CAP矯正過(guò)程行動(dòng)CorrectiveActionProcess.·CAR矯正措施要求CorrectiveActionRequestorComputerAidedRepair.·CAT計(jì)算機(jī)輔助測(cè)試Computer-AidedTest.·CCA電路板組裝CircuitCardAssembly.·CCRP顧客投訴解決過(guò)程CustomerComplaintResolutionProcess.·CFM連續(xù)流生產(chǎn)ContinuousFlowManufacturing.·CFT顧客焦點(diǎn)小組CustomerFocusTeam,ateamdedicatedtothecustomer,madeupofSPTexpertsfrom.eachstrategicareaofthemanufacturingprocess–supply-basemanagement,inventory.control,engineeringservices,masterscheduling,documentcontrol,qualityassuranceandcustomerreporting.TheCFTprovidescomprehensiveprojectmanagementandclose.communicationthroughouttheentire·CIM計(jì)算機(jī)集成制造ComputerIntegratedManufacturing.·CIRM集成資源管理認(rèn)證CertifiedinIntegratedResourceManagement(APICScertification).·COB通過(guò)邦定將IC固定于印刷線路板上Chip-on-board,amethodofaffixinganunencapsulatedchipontoaPCButilizingwire.bondingprocess.·COC將芯片貼裝在瓷質(zhì)基板上Center·COF將芯片固定于軟板上Chip-on-flex.·COS將芯片倒裝在板上Chip-on-substrate.·CP制程能力ProcessCapability.·CPIM生產(chǎn)和庫(kù)存管理認(rèn)證CertifiedProductionandInventoryManagement.·CPK制程能力指數(shù)Processcapabilitymeasurethattakesintoaccounttheprocessaverage.·CPM關(guān)鍵路徑法CriticalPathMethod.·CRP能力需求計(jì)劃CapacityRequirementPlanning.·CRT陰極射線管CathodeRayTube.·CSI顧客滿意指數(shù)CustomerSatisfactionIndex,atoolSPTusestoobtainfeedbackfromitscustomersonSPT.'sperformance.·Circuitdesign電路設(shè)計(jì)Abilitytodesignthecircuitlogicthatallowselectroniccomponentstoperformaspecificfunction.·Complexsystemsassembly復(fù)雜系統(tǒng)裝配Abilitytoassembleandtestsystemsthatinvolvelargescaleassembly,integration,stagingandproductsupport;thatrequireextensivetestingandconfiguration;havehighpartcounts/complexBOMmanagement;requireengineeringchangesandacceleratedtesting(e.g.HASS,powercycling)·Configure-to-ordersystemsassembly定制訂單裝配Takesanalreadybuiltorpartiallybuiltunitandaddsspecificperipheralsandsoftware.forindividualcustomerorder.Shipdirecttocustomer.·Componentengineering組件工程Theserviceofapplyingengineeringknow-howtotheprocessesofcomponentselection,.applicationandprocurement.Canprovideanalysisofnewtrendsinelectronicdevices.·Contractmanufacturing合約制造Thepracticeofmakingproductsorsubcomponentsofproductstobesoldunderadifferentcompany’sname.·Corecompetencies核心競(jìng)爭(zhēng)力Thosefunctionsorpracticesdeemedbyacompanyascentraltoitsexistence..Thoseactivitiesthatthecompanybelievesitdoesbest,shouldfocusonandthatareinthecompany’sbestinterestforlong-termsuccessandgrowth.·Custompackaging代客產(chǎn)品包裝Custompackagingistheabilitytoaddvaluetothebasic"boxandship"endofdistribution.Forexample,addingproductliteratureorpromotionalitems,andshippingittothecustomer.inaboxprintedwiththeOEM'spackagingdesign–i.e.thelogo.·Customerservice售后服務(wù)Voice,electronicandweb-basedtechnicalservicesupport,technicalservices,softwaresupport,outbounddemand,outboundcustomersatisfaction.·DMR材料差異報(bào)告DiscrepancyMaterialReport.·DPM每百萬(wàn)有多少不良DefectsPerMillion.·DVT設(shè)計(jì)驗(yàn)證DesignVerificationTest.·Design-for-X(DFX)面向xx的設(shè)計(jì)Thevalue-addedserviceofinstituting“bestpractices”inthedesignstagetoimproveX,whereXismanufacturability,testability,serviceability,etc.DFXcanincludeanalysisofdesigndocumentationforproductionreadinessandintegrity,bestselectionofcomponentsforfunctionality,costandavailability,designforbestmanufacturingandassemblyofPCBsandandsystem,anddesignofbestcosteffectivetests.·Designvalidation設(shè)計(jì)驗(yàn)證Providesaprocessthatsubjectsadesigntoaseriesofstressteststodetermineitsrobustness.·Dock-to-stock免驗(yàn)Asupplierqualitymanagementpracticethatallowsacomponentorproducttoenterintocompanywithoutgoingthroughanincominginspectionuponarrivalatthereceivingdock.·EDI電子數(shù)據(jù)交換ElectronicDataInterchange,theelectronictransferofpre-formattedbusinessdocuments.·EMS電子制造服務(wù)ElectronicsManufacturingServices,theindustrybasedonprovidingmanufacturingservices.forelectronicsOEMs.·EOL生命周期末端EndofLife,thestageofaproductwherethereislittlecontinueddevelopmentbeforeitiswithdrawnfromthemarket.·ERP企業(yè)資源計(jì)劃EnterpriseResourcePlanning,apackagedapplicationthatenablesacompanytoautomatealmosteveryaspectofitsoperationsbytyingitsERPdatabasestoitsintranetandextranetandallowingfullbrowseraccesstothem.·ESD靜電放電ElectrostaticDischarge.·EVT工程驗(yàn)證EngineeringVerificationTest.·Endoflifemanufacturing制造生命周期末期Generallyinvolvesthesupportoflowvolumenewbuildtosupportservicedemandwherethereturnratesfromservicedonotsupporttheservicedemandrate.WillinvolveBOMmanagement,AVLmanagement,materialrecovery,ordermanagement,manufacturingtoolarchives.·Environmentalstressscreening應(yīng)力篩選Aprocessbywhichcomponentsorassembliesaretestedattheextremesoftheirnormaloperatingconditions,usuallyintermsoftemperatureandvoltagelimits,foraperiodofhoursordaysinordertodetectearlylifedefects.Itisnotmeanttobeadestructivetest.·FPGA現(xiàn)場(chǎng)可編程門陣列FieldProgrammableGateArray.·Fastdepot快速儲(chǔ)存FRUexchange,ECOupgrade,NTFscreen,test,fieldreadypackout,advancedexchange,directship,FGImanagement.·Five(5)S5SFive-itemauditprocesswhichfocusesonorderlinessandneatnessSeiri–OrganizationSeiton–OrderlinessSeiso–CleanlinessSeiketsu–StandardizedCleanupShitsuke–Discipline·Flexiblecircuitassembly柔性電路裝配Second-levelintegrationofactiveandorpassivedevicesonaflexible,formablesubstrate.·Fortune500財(cái)富500強(qiáng)AlistcompiledbyFortunemagazineofthe500largestmanufacturingandservicecompaniesintheUnitedStates.·Fulfillment直接分銷Aprocessthatsuppliesafinishedmanufacturedproductdirectlyfromamanufacturingfacilitytoadistributororenduserwithoutthefinishedproductgoingbackthroughthecompanythathascreatedtheproduct.Thefulfillmentcyclemayincludereceivingcustomerorders,configuringtheproductstoorder,shippingandinvoicingproductstodistributionoutletsorendendusersaroundtheworld.·IEEE電子電氣工程協(xié)會(huì)InstituteforElectronicandElectricalEngineers.·IPI在線檢查InProcessInspection,abuiltininspectionfunctioninthemanufacturingprocess.·ISO國(guó)際標(biāo)準(zhǔn)組織InternationalStandardsOrganization.·JustinTime(JIT)manufacturing(kanban)及時(shí)生產(chǎn)Thematerialhandlingpracticethatminimizesoreliminatestheamountofproductbroughtintoinventorybysettingupadeliveryschedulethatbringsmaterialsdirectlyfromthesuppliertotheproductionfloor.·Kaizentechnique改善技術(shù)Continuousimprovement.·Kanban看板AcardattachedtostandardcontainersthatisusedtocontroltheflowofmaterialsthroughJITorpull-manufacturingsystems.·Kitting備料Gatheringpartsintokitsforproductionassembly.·Logisticsmanagement物流管理Managesthereverseflowofdefectiveproductfromtheenduserthroughthevariousstepstorepairandthenbackouttotheenduser.Willinvolveinventorymanagement,remotestockinglocationmanagement/re-provision,reverselogistics,advancedexchange,warehousing,externalshipping/receiving,freightcarriermanagement,scheduling,forecasting,import/export,freightdatacollection,turnaroundtimemetrics.·Logisticsanddistributionmanagement物流配送管理Logisticsinvolvesthesorting,warehousingandshippingofrawgoodsandfinishedproduct.Distributionmanagementfocusesondirectshipmentstotheenduser.·MCM多芯片組件Multi-chipModule,atypeofsemiconductorpackageusedinPCBassembly.·MPS主生產(chǎn)計(jì)劃MasterProductionSchedule.·MRB材料審查會(huì)議MaterialReviewBoard.·MRP物料需求計(jì)劃MaterialsRequirementsPlanning,originalmanufacturingbusinesssoftwarethatfocusesonlyonplanningthemanufacturingmaterialsandinventoriesanddoesnotintegrateplanningforotherresources,likepeopleandmachinecapacity.·Manufacturability可制造性Thecharacteristicsofaproductdesignthatallowittobeproduced.·Manufacturingandtechnologyroadmap制造技術(shù)藍(lán)圖Providingastrategicoutlineofwhatmanufacturingandtechnologymethods,machinesandprocesswillbeused.·Mechanicaldesign機(jī)構(gòu)設(shè)計(jì)Abilitytodophysicaldesignsthataccomplishaspecificfunctionthroughtheworkofelectronicsubassembliesandmechanicalpartsandsub-assemblies.Gears,sheetmetal,andplasticpartsaresomeofthemechanicalcomponents.Powersupplies,PCBassemblies,fansaresomeofthemechanicalsub-assemblies.·NODE節(jié)點(diǎn)Anyindividuallyaddressablepointinanetwork.·NewProductIntroduction(NPI)management新產(chǎn)品導(dǎo)入管理Providesabusinessprocesstohelpthecustomerachieveacost-effectivequick-to-volumeproductiondesign.Theprocessismosteffectivewhenthecustomerengagesattheconceptphaseoftheproduct'sdevelopmentcycle.Itcanincludetechnologyselection,design,test.andmaterialstrategies,DFX,component,designanddevelopmentengineerservicesandrapidboardandsystemprotobuildservices.·ODM原始設(shè)計(jì)制造商OriginalDesignManufacturer,businessmodel/productmanufacturingmethodwherebyproductisdesignedandassemblyisperformeduponreceiptoffunctionalrequirementsforatypeofproduct.InthetypicalODMmodel,themanufacturerdesignsthecompleteproduct.Inothercases,theODMmayrelyonacombinationoforiginaldesigncapabilitiesforsomeassemblies/componentsandoff-the-shelfcomponentsandassembliestomeetthecustomerrequirements.Advantages:greatestlevelofcustomization,productdifferentiation.·OEM原始設(shè)備制造商OriginalEquipmentManufacturer,thecompanybehindthe“brandname”ofaproduct.·Outsourcing外包Thepracticeofsubcontractingworktooutsidecompanies.·PAL可編程陣列邏輯ProgrammedArrayLogic.·PCB印刷電路板PrintedCircuitBoard,asheetofinsulatingmaterialcarryingcircuitelementsandterminalssothatitcanbeinsertedintoanelectricalapparatus(suchasacomputer).·PCBlayout印刷電路板布局TheabilitytocreatethephysicalrealizationofanelectricaldesignincludingASIC,circuitorRFdesigns.·PCBA印刷電路板裝配PrintedCircuitBoardAssembly,theactofinstallingcomponentsonaPCB.·PCMCIAPC機(jī)內(nèi)存卡國(guó)際接口PersonalComputerMemoryCardInternationalInterface,astandardforcredit-cardsizedmemoryandmodemcardsforportablePCs.·PPB十億分之一PartsperBillion.·PPM百萬(wàn)分之一PartsPerMillion.·PTH通孔裝配技術(shù)Pin-through-holetechnology,amethodofsolderingelectricalcomponentstoaboardsubstratethatinvolvespin-through-holeconnections.·PVT量產(chǎn)驗(yàn)證測(cè)試ProductionVerificationTest.·PWB平面印刷線路板PrintedWiringBoard.·Partsmanagement元件管理Serialnumbertracking,ECmanagement,partsexchange,configurationmanagement,FGIlevels,secondarychannelsales,partssale/restocking,advancedsales,sub-contractrepairmanagement.·PokeYoketechnique防呆技術(shù)AJapanesetermformistake-proofdesign.·Printedcircuit印刷電路Acircuitforelectronicapparatusmadebydepositingconductivematerialincontinuouspathsfromterminaltoterminalonaninsulatingsurface.·Printedcircuitboardassembly印刷電路板裝配Second-levelintegrationofactiveandpassivedevices(electrical,electronic,opticaland/ormechanical)onarigidsubstrate.·Printedcircuitboardlayout印刷電路板布局Theprocessoftransformingtheelectricaldesign(functionalorlogicalrepresentation)intoaphysicalobject(physicallayoutofplacingcomponentsandroutingofinterconnectwires)·Processdevelopment過(guò)程開(kāi)發(fā)Tailoringorbuildingmanufacturingmethodsfortechnologymixelectedbycustomer.·Programmanager項(xiàng)目經(jīng)理TheoverallbusinessmanageratSPTresponsibleforaparticularcustomerwhodirectsallactivitiesperformedatSPTinsupportofthatcustomer.ThispersonisthekeylinkbetweenthemanufacturingteamatSPTandproductmanagementatthecustomer.·Programoffice項(xiàng)目辦公室ASPTlocationthatfunctionsasaliaisonfordealingwithbothsuppliersandcustomersinaregion.TheprogramofficesinSingapore,HongKong&Shenzhenworktoestablishandmaintainrelationshipswithsuppliersandservesasabaseforbusinessdevelopmentactivitieswithcustomers.·Pullsystem拉式生產(chǎn)Inproduction,referstotheproductionofitemsonlyasdemandedforuse,ortoreplacethosetakeforuse.Inamaterialscontrolcontext,referstothewithdrawalofinventoryasdemandedbyusingoperations.Materialisnotissueduntilasignalcomesfromtheuser.·Pushsystem推式生產(chǎn)Inproduction,referstotheproductionofitemsattimesrequiredbyagivenscheduleplannedinadvance.Inamaterialcontrolcontext,referstotheissuingofmaterialsaccordingtoagivenscheduleandorissuingtoajoborderanditsstarttime.·QA質(zhì)量保證QualityAssurance,activitiestoassureoutgoingandcustomerproductquality;inspectionisonlyaminorpartofQAactivity.·QC質(zhì)量控制QualityControl,inprocessquality.·QIP質(zhì)量改善過(guò)程QualityImprovementProcess.·Quick-turnprototyping快速原型Abilitytoproduceasampleofaproductinarelativelyshorttime.Typically2-5daysfromreceiptofalltheboard-levelcomponents.·Quick-turntesting快速測(cè)試Testingofaproductusingmethodswhichareeasytoimplement.Forexample,flyingprobe.·Reconfiguration重新配置Upgradinganexistingproductbyreplacingsubsytems,peripherals,softwareorcabling.·Reflow回流焊Aprocesstoformasolderjointbyprovidingheattothesolderpaste.·Reliabilityandfailureanalysis可靠性失效分析Capabilitytodeterminetherootcauseofacomponentorassemblydefectorfailureaswellastopredictthe“l(fā)ife”ofaboardorsystem.Thisisusuallyexpressedintermsof“meantimebetweenfailures”(MTBF).·Repairandmaintenance維修保養(yǎng)Repair,refurbishment,remanufacturing,upgrades,testandburn-in,componentdebug,fieldreadypackout,directship,RMAcontrol,advancedexchange,DGImanagement,ECmanagement,datarecovery,failureanalysis,materialrecovery.·Returnsprocessing重工Receiving/partsID,warrantyvalidation,varianceresolution,NTFscreen,re-box/re-stock,ECmanagement,datarecovery,failureanalysis,materialrecovery.·RFandwirelessdesign無(wú)線射頻設(shè)計(jì)Abilitytodocircuitdesignsthatoperateinarangeofelectromagneticfrequenciesabovetheaudiorangeandbelowvisiblelight.Allbroadcasttransmission,fromAMradiotosatellites,fallsintothisrange,whichisbetween30KHzand300GHz.·SMT表面貼裝技術(shù)SurfaceMountTechnology,amethodofsolderingelectricalcomponentsdirectlytoaboardsubstratethatuseslessspacethanthepin-through-holemethod.·Six-Sigma六西格瑪Whereprocessesaretwiceasgoodastheyneedtobeandallowedtoshiftupto50%.Theresultingerrorratewillremainlessthan3.4ppm.·Soldersample焊錫樣本Ascrapedboardthatisusedforthecross-sectionandthewavesoldertest.·Supply-basemanagement供應(yīng)基地管理SPT'smaterialsmanagementorganization.Includesactivitiessuchaspurchasingandinventorycontrol.·Supply-chainandlogisticsmanagement供應(yīng)鏈管理Supply-chainmanagementistheabilitytoensureasteadyflowofmaterialsthroughthemanufacturingprocess.Logisticsmanagementinvolvesthesorting,warehousing,andshippingrawgoodsandfinishedproducts.·Systemsdesign系統(tǒng)設(shè)計(jì)Abilitytododesignsthatcomprisetheinteractionandintegrationofvarioussub-assembliesintoasingleassemblytoaccomplishanintendedfunction.Thesub-assembliescanconsistofelectrical,mechanical,optical,software,acousticalandothercomponentstoachieveoverallfunctionality.ExamplesofsystemsdesignincludedesigningaPC,acellularphoneorapager.·Systemsintegrat