微專業---半導體制造技術課程：半導體工程專業英語ContentsSemiconductorProperties半導體特性01SemiconductorMaterials半導體材料02SemiconductorDeviceandHowTheyareUsed半導體器件及其使用03ProcessTechnology工藝技術04FabricationProcesses制造工藝05SemiconductorMaterialsandProcessCharacterization半導體材料與工藝表征06SemiconductorDevicesandHowTheyAreUsed3.1SemiconductorDevices3.2ConstructingSemiconductorDevice3.3Two-TerminalDevices:Diodes3.4ThreeTerminalDevices:Transistors3.5IntegratedCircuits3.6ImageDisplayingandImageSensingDevices3.7Micro-Electro-MechanicalSystems(MEMS)andSensors3.8WearableandImplantableSemiconductorDeviceSystems03

Thebasicideabehindthemonolithicintegratedcircuittechnologyisto

fabricateacompleteelectroniccircuitonasmallpieceofsemiconductor

commonlyreferredtoasachip.Inotherwords,notonly

transistorscomprisingacircuit,butalsoconductinglinesinterconnecting

transistorsinthecircuitareprocessedintoatinypieceof,forinstance,silicon

whichisthenencapsulatedintohermeticallysealedpackageequippedwith

input/outputpins,andreadyforinstallationinthelargerelectroniccircuit.11Introduction3

SemiconductorDevicesandHowTheyAreUsed

3.5IntegratedCircuits/?n?k?psjule?t?d/封進內部/h??r?met?klisi?ld/密封地/?mɑ?n??l?θ?k/整體的Electroniccircuitsimplementedusing(a)discreteelementsforminga

circuitmountedontheprintedcircuitboard(PCB),and(b)acircuitintegrated

ontosemiconductorchiprepresentingmonolithicintegratedcircuittechnology.123

SemiconductorDevicesandHowTheyAreUsed

3.5IntegratedCircuits/?mɑ?n??l?θ?k/整體的Text/?ma?nt?d/安裝好的/d??skri?t/分離的/?mɑ?n??l?θ?k/整體的Basicclassesofintegratedcircuits(ICs).133

SemiconductorDevicesandHowTheyAreUsed

3.5IntegratedCircuits/?mɑ?n??l?θ?k/整體