微專業---半導體制造技術課程：半導體工程專業英語ContentsSemiconductorProperties半導體特性01SemiconductorMaterials半導體材料02SemiconductorDeviceandHowTheyareUsed半導體器件及其使用03ProcessTechnology工藝技術04FabricationProcesses制造工藝05SemiconductorMaterialsandProcessCharacterization半導體材料與工藝表征06FabricationProcesses5.1PatternDefinitionSchemes5.2ProcessingStepsinTop-DownSequence5.3SurfaceProcessing5.4AdditiveProcesses5.5Lithography5.6SubtractiveProcesses5.7SelectiveDoping5.8ProcessingofContactsandInterconnects5.9AssemblyandPackaging0515Introduction

Thissectionconsidersselectedkeyissuesrelatedtosurfaceprocessing

technologyinsemiconductormanufacturing.First,surfacecleaningprocessesareconsidered.Then,meritsandimplementationofoperationsreferredtoassurfaceconditioningarediscussed./??mpl?ment?d/實現5.3SurfaceProcessing/k?n?d???n??/處理/?mer?ts/優點5FabricationProcesses16

Surfacecleaningistheprocessaimedattheremovalofsolids,nonvolatile

contaminantssuchasparticlesormetallicimpuritiesfromthe

surfacewithoutuncontrolledalterationsofitscharacteristics./n?n?v?l?ta?l/非揮發性的/???lt??re??(?)n/改變5FabricationProcesses5.3.1

SurfacecleaningText5.3SurfaceProcessingImplementationofthesurfacecleaningprocesses./k?n?t?m?n?nt/污染物17WetcleaningDuringthemostcommonlyusedinsemiconductorfabricationwetcleaningoperations,contaminantsareremovedviaselective

chemicalreactionsintheliquid-phasewhichcauseseithertheirdissolution

inthesolvent,orconversionintothesolublecompounds./k?n?v??r?(?)n/轉變/?sɑ?lj?b(?)l/可溶的5FabricationProcesses5.3.1

Surfacecleaning5.3SurfaceProcessing18DryCleaningInthiscaseremovalofcontaminantfromthesurfacetakesplacevia

chemicalreactioninthegas-phaseconvertingitintoavolatilecompound

(Fig

(a)),orasaresultofmomentumtransferbetweenspeciesimpinging

onthesurfaceandsurfacecontaminants(Fig

(c)),orasaresultofsurface

irradiation(IR-heating,UV-bondbreaking/oxidation)sufficienttoovercome

forcescausingvolatilecontaminanttoadheretothesurface(Fig

(d)).

/mo??ment?m/動能/?m?p?nd???/沖擊/?d?h?r/黏附5FabricationProcesses5.3.1

Surfacecleaning5.3SurfaceProcessing/??re?di?e??n/照射/s??f??(?)nt/足夠的19

Surfaceconditioningoperationscanbecarriedoutusingeitherwetordry

chemistriesaswellastoolsandmethodsusedinsurfacecleaningoperations.

Thegoalistoenforcesurfaceterminationassuringstable,timeandambient

resistant,aswellasreproduciblesurfacecharacteristics./?n?f??rs/強化/??mbi?nt/環境的/?ri?pr??du?s?bl/可重復的5FabricationProcesses5.3.2

SurfaceconditioningText5.3SurfaceProcessing(a)Siliconsurfaceasexposedtoambientair,(b)hydrogenterminatedSi

surface./?t??rm??ne??(?)n/鍵飽和20In-classexercisConnecttheEnglishwords/phrasesandChinesemeaningwithlines.dryprocesssurfacecleaninglift-offprocesssoft-lithographyetchingprocess表面清洗軟光刻刻蝕工藝剝離工藝干法工藝5FabricationProcesses21In-classexercisFillintheblankswithproperwordsorphrases.1.The

isusedwithmaterialswhichbecauseofitsresistancetoetching,forinstancegold,cannotbepatternedfollowingconventionaltop-downprocedure.

2.

istheprocessaimedattheremovalofsolids,nonvolatilecontaminantssuchasparticlesormetallicimpuritiesfromthe

surfacewithoutuncontrolledalterationsofitscharacteristics.5FabricationProcesses22單詞/短語音標中文含義2D(two-dimensional)printing/da??men??n(?)l/2D印刷3D(three-dimensional)printing/da??men??n(?)l/3D打印additivemanufacturing/??d?t?v?m?nju?f?kt??r??

/增材制造additiveprocesses/??d?t?v?prɑ?ses?z

/增材工藝anisotropicetching/??na?s??trɑ?p?k?et???/各向異性刻蝕AtmosphericPressureCVD(APCVD)/??tm?s?f?r?k?pre??r/常壓化學氣相沉積AtomicLayerDeposition(ALD)/??tɑ?m?k?le??r?dep??z??n/原子層沉積back-end-of-the-line(BE-OL)/la?n/后道batchprocessing/b?t??prɑ?ses??

/批量工藝KeyTerms5FabricationProcesses23單詞/短語音標中文含義blanketdeposition/?bl??k?t?dep??z??n/均厚沉積chemicaletching/?kem?k(?)l?et???/化學刻蝕chemicalinterface/?kem?k(?)l??nt?rfe?s/化學界面ChemicalVaporDeposition(CVD)/?ve?p?r?dep??z??n/化學氣相沉積Chemical-MechanicalPlanarization(CMP)/m??k?n?k(?)lpl?n?ra?'ze??n/化學機械拋光/平坦化computationallithography/?kɑ?mpju?te???nll??θɑ?ɡr?fi/計算光刻conformalcoating/k?n?f?rm?l?ko?t??/保形覆蓋contactprinting/?kɑ?nt?kt?pr?nt??/接觸式光刻criticaldimension(CD)/?kr?t?k(?)lda??men?n/關鍵尺寸5FabricationProcesses24單詞/短語音標中文含義damasceneprocess/?d?m?sin?prɑ?ses/大馬士革工藝/鑲嵌工藝DeepReactiveIonEtching(DRIE)/ri??kt?v?a??n?et???/深反應離子刻蝕diffusion-controlledprocess/d??fju??nk?n?tro?ld?prɑ?ses/擴散控制過程directwritelithography/d??rektra?tl??θɑ?ɡr?fi/直寫光刻dopant,doping/?do?p?nt//?dop??/摻雜劑，摻雜dryprocess/?prɑ?ses/干法工藝e-beamevaporation/??v?p??re??(?)n/電子束蒸發e-beamlithography/l??θɑ?ɡr?fi/電子束光刻electrodeposition/??lektr???dep??z???n/電沉積electromigration/elektro?m?ɡ're??n/電遷移etchingprocess/?et????prɑ?ses/刻蝕工藝5FabricationProcesses25單詞/短語音標中文含義evaporation/??v?p??re??(?)n/蒸發excimerlaser/?eks?m?r?le?z?r/準分子激光front-end-of-theline(FEOL)/la?n/前道full-fieldexposure/?k?spo???r/全域曝光heterogeneousintegration/?het?r??d?i?ni?s??nt??ɡre??(?)n/異質集成High-PressureOxidation(HIPOX)/?ɑ?ks??de??n/高壓氧化hydrogentermination/?ha?dr?d??n?t??rm??ne??(?)n/氫終止hydrophilicsurface/?ha?dr??f?l?k?s??rf?s/親水表面hydrophobicsurface/?ha?dr??fo?b?k?s??rf?s/疏水表面immersionlithography/??m??r?nl??θɑ?ɡr?fi/浸沒式光刻InductivelyCoupledPlasma(ICP)/?n?d?kt?vli?k?pld?pl?zm?/電感耦合等離子體5FabricationProcesses26單詞/短語音標中文含義interleveldielectric/?n?t?:(r)?lev(?)l?da???lektr?k/層間電介質ionbeamsputtering/?a??nbi?m?sp?t?r??/離子束濺射ionimplantation/??mpl?n?te??n/離子注入ionmilling/?m?l??/離子銑削isotropicetching/?a?s??trɑ?p?k?et???/各向同性刻蝕lateraldiffusion/?l?t?r?ld??fju??n/橫向擴散lift-offprocess/?l?ft??f/剝離工藝LowPressureCVD,LPCVD/?pre??r/低壓化學氣相沉積magnetronsputtering/?m?ɡn??tr?n/磁控濺射maskedlithography/l??θɑ?ɡr?fi/掩模光刻maskalignment/??la?nm?nt/掩模對齊5FabricationProcesses27單詞/短語音標中文含義mechanicalmask/m??k?n?k(?)l/機械掩模megasonicagitation/meɡ?'s?n?k??d???te??(?)n/兆聲清洗metalorganiccompound/?met(?)l??r?ɡ?n?k?kɑ?mpa?nd/金屬有機化合物MetalorganicCVD,MOCVD/?met(?)l??r?ɡ?n?k/金屬有機物化學氣相沉積minimumfeaturesize/?m?n?m?m?fi?t??rsa?z/最小特征尺寸mistdeposition/m?st/噴霧沉積molecularbeam/m??lekj?l?r/分子束MolecularBeamEpitaxy(MBE)/?ep??t?ksi/分子束外延multipleprinting/?m?lt?p(?)l/多次曝光non-opticallithographies/?ɑ?pt?k(?)l/非光學光刻nonselectiveetching/?nɑ?ns??lekt?v/非選擇性刻蝕5FabricationProcesses28單詞/短語音標中文含義patterntransferlayer/tr?ns?f??r/圖案轉移層photolithography/?fo?to?l??θɑ?ɡr?fi/光刻physicaletching/?et???/物理刻蝕physical/chemicaletching/?et???/物理/化學刻蝕PinGridArray(PGA)/ɡr?d/引腳網格陣列PlasmaEnhancedCVD(PECVD)/?n?h?nst/等離子體增強化學氣相沉積plasmaenhancement/?n?h?nsm?nt/等離子體增強plasmaetching/?et???/等離子刻蝕preferentialetching/?pref??ren?(?)l/優先腐蝕proximityeffect/prɑ?k?s?m?ti/鄰近效應proximityprinting/?pr?nt??/接近式光刻5FabricationProcesses295FabricationProcesses單詞/短語音標中文含義RapidThermalOxidation(RTO)/?ɑ?ks??de??n/快速熱氧化ReactiveIonEtching(RIE)/ri??kt?v?a??n/反應離子刻蝕reactivesputtering/?sp?t?r??/反應濺射remoteplasma/r??mo?t/遠程等離子體resolutionenhancingtechnique/?rez??lu??(?)n/分辨率增強技術selectivedoping/?dop??/選擇性摻雜selectiveetching/?et???/選擇性刻蝕Self-AssembledMonolayer(SAM)/??sembld?mɑ?no??le??r/自組裝單分子膜shadowmask/???do?/陰影掩模soft-lithography/s??ftl??θɑ?ɡr?fi/軟光刻spincoating/sp?n?ko?t??/旋涂30單詞/短語音標中文含義sputterdeposition/?sp?t?r?dep??z??n/濺射沉積sputteretching/?sp?t?r??et???/濺射刻蝕step-and-repeatexposure/?k?spo???r/分步重復曝光struc