1、Inner layer dry/film 內層干菲林Blocking boards 卡板 Lack copper 少銅Inner scrap 內層報廢 Uncomplete tearing film 撕膜不凈 Soft inner 內層變軟 Conductor lift 崩線Inner misregistration 內層錯位 Bulge on conductor 線路凸位 Inner short 內層短路 Poor conductor 線路不良 Inner open 內層開路 Pattern misregistration 線路圖形歪 Inner slight short 內層微短 Elli

2、ptical hole 橢圓孔 Pressing 壓板DRY PLY DRY PLY Inner shift 內層偏位 Tg value out of spec. Tg 超出要求 Inner hole position incorrect 內層歪孔 Tg value not meet the requirement Tg 達不到要求 Lay up in reverse 排反板Dent凹折 The incision length not meetthe requirement切割長度達不到要 求Measling 白斑 Board poor cutting 切壞板 Poor edge 板邊不良 B

3、urnt 燒焦Burrs on board edge 板邊毛刺 The resin content lower thanthe requirement樹脂含量低于要求Resin shortage in board edge 板邊缺樹脂 Void in resin 樹脂空洞Fibre in board edge 板邊纖維絲 Dissipation factor beyondcriteria損耗因子達不到要 求Thin board thickness 板薄 Make wrong guide hole 挑錯管位 Excess board thickness 板厚 Thinner copper thi

4、ckness 銅箔偏薄Board out of spec. 板厚不合要求 Dlamination between surfacecopper and prepreg銅箔氣泡Lamination wrinkles 板料布紋 Bow and twist out of spec 彎曲性超標 Lamination blisters 板料氣泡 Dusty and damage 污損Rough board surface 板面不光滑 Absorption beyond criteria 吸水性超標Board surface extrusion 板面突起 Construction of fiber not

5、meetrequirement纖維結構不符要求Dent by pressing board 板面壓傷 Pressing dent 壓板凹痕Board warp/bow 板彎 /曲 Poor lamination 壓板不良Board small 板小 Failed pressure vessel test 壓力鍋測試未達標 Protective film too thick or thin 保護膜偏厚 &偏薄 Fracture 壓傷Delamination 爆板 Oxide 氧化Peel strength under requirement 剝離強度未達標 Misuse prepreg

6、用錯 P 片Black oxide scratch 擦花黑化 Laminate misused 用錯板料Layer structure not meet MIrequirement層壓結構不符 MI 要求 Misuse inner P/R 用錯內層 P/R Poor dimensional stability 尺寸穩定性未達標 Misuse Cu coil 用錯銅箔 Delamination/Blister 分層 /起泡 Weave texture 織紋顯露Poor cutting 割板不良 Wrinkles 皺折痕Guide hole over size 管位大孔 Marked legend

7、 shift 字嘜打偏Guide pin shift 管位釘打偏 Marked legend in unit 字嘜入單元Guide hole shift 管位歪孔 Stain on board 板面污漬Poor black oxide 黑化不良 Bow 板彎Board slip in pressing 滑板 Copper clad thickness underspec.表面銅薄Foreign material in laminate 基材內異物 Copper clad thickness overspec.表面銅厚Joint glue too thick or thin 接著劑偏厚 &

8、;偏薄 Drilling wrong guide hole 打錯管位Unqualified dielectric layer 介電層不合格 Inner layer cu thickness underspec.內層銅薄Page 1 of 5Thin dielectric layer thickness 介電層偏薄 Inner layer cu thickness overspec.內層銅厚Excess dielectric layer 介電層偏厚 Foreign material in innerlayer內層雜物Electronic inductivity beyond standard 介

9、電常數未達標Length and width not meetspec.外圍尺寸不符合要 求Cutting wrong laminate 開錯料 Marking wrong 打錯字嘜 Missing guide hole 漏打管位 Missing marking 漏打字嘜 Missing black oxide 漏黑化 Poor staff 板料不良 Exposed/Disrupted fibres 露纖維 /纖維斷裂 Poor marking 打字嘜不良 Routing guide hole shift 鑼偏管位孔 Board break 板裂Pits 麻點 The joint of cop

10、per foil 銅箔接口 Inner white spot 內層白點 Skipping inner-layer 少排內層 Improper inner layer 內層不配套 Skipping prepreg 少排 P 片 Inner scratch 內層擦花 Pattern perforation 線路穿孔 Inner pink ring 內層粉紅圈 Poor mechanical pressing 機械壓傷不良 Inner glue residue 內層膠漬Drilling 鉆房Broken guide hole 打爆管位 Hole diameter over size 鉆大孔Drill

11、 bit broken 斷針 Drilling extra hole 鉆多孔 Scrape 刮花 Drilling in reverse 鉆反孔 Deformed hole 孔變形 Poor drilling 鉆孔不良 Burrs in hole 孔內披鋒 Drilling un-through 鉆不穿 Drilling skip 漏鉆孔 Drilling hole misalignment 鉆歪孔 Drilling wrong boards 鉆錯板 Hole diameter under size 鉆小孔 Drilling wrong hole 鉆錯孔 Hole damaged 鉆炸孔 Te

12、nting hole/Plugging 塞孔PTH/PP 沉銅 /板面電鍍Board surface dent 板面凹痕 Copper thread in hole 孔內銅絲 Board surface copper nubbles 板面銅粒 No copper in hole 孔內無銅Board folding and breaking 板折壞 Copper in hole(NPTH 孔內有銅 (非鍍銅 孔 Poor plating 電鍍不良 Board damaged by scrubbing 磨壞板 The plating thickness not uniform 電鍍層不均勻 Pla

13、ting copper peel off 銅層剝離 Rough plating 電鍍粗糙 Wicking 滲銅 Hole plugged by plating 電鍍塞孔 Drilling hole failure 鉆飛孔 Burnt board by plating 電鍍燒板 Board scratched by machine 機械刮傷Boards-drop into the tunnel 缸底板 Mechanical drilling holemisalignment機械鉆歪孔Burrs on hole-edge 孔邊毛刺 Poor mechanical drilling 機械鉆孔不良Ro

14、ugh hole wall 孔粗 Big hole of mechanicaldrilling機械鉆大孔Hole black 孔黑 Extra hole of mechanicaldrilling機械鉆多孔Missing hole of mechanicaldrilling機械鉆漏孔Dry/Film 干菲林Hole breakout 崩孔 Glue residue 膠漬Film scratch 擦花菲林 Missing PAD 漏 PAD Scratching prevent tin 擦花錫面 Missing date code 漏印周期 Under developing 沖板不凈 Poor

15、in D/F lamination 轆菲林不良 Over developing 沖板過度 Poor exposure 曝光不良 Broken dry film 穿菲林 Exposure foreign material 曝光垃圾Overlap boards 疊板 Bleeding copper plating(wicking滲鍍Page 2 of 5Same location trace open 定位斷線 Peel off D/F 甩菲林Short 短路 Misuse film 用錯菲林 Trace open 斷線 Foreign inclusions 雜物Put wrong D/F 放錯菲

16、林 Pin hole 針孔Put D/F in reverse 放反菲林 Unclear date code 周期不清 Film wring 菲林起皺 Mistake date code 用錯周期 Film in hole 菲林入孔 Foreign material under film 菲林下雜物 D/F residue 菲林碎Pattern plating & Etching & M/I圖電 /蝕刻 /中檢Dishdown 碟形凹痕 Trace undersize 線幼Dirty 板污 Chemical solution polluting 藥水Copper residue

17、 殘銅 Lower impedance 阻抗偏低 Dropped D/F 掉菲林 Higher impedance 阻抗偏高 Poor tin plating 鍍錫不良 Resistance out of requirement 電阻不合要求 Trace broken by clamper 夾崩線路 Hole knocked down 撞崩孔D/F clamping 夾菲林 Trace shift (by damage 撞歪(斷線 Under etching 蝕板不凈 Scrap by machine blocking 塞機報廢 Over etching 蝕板過度 Mechanical bro

18、ken trace 機械撞斷路 Unclear etching legend 蝕字不清 Poor circuit reworking 補線不良 Thin copper plating 銅薄 Poor rework 修理不良 Excess copper thickness 銅厚 Burned trace open 燒斷線Film under stripping 褪菲林不凈 SMT PAD undersize 錫手指幼 Tin under stripping 褪錫不凈 Edge roughness(dull line 線路狗牙 Thin tin coating 錫薄 Trace spacing u

19、ndersize 線隙不足 Nicks 缺口 Boards damaged 板損壞W/F 濕綠油Board discolor 板黃 S/M on SMT PAD 綠油上錫手指 S/M skipping 不過油 Foreign material under S/M 綠油下雜物 Scratch 擦花 Poor S/M color 綠油顏色不良 Damaged by pin pressing 釘床壓傷 Poor scrubbing 磨板不良 Weave exposure 基材白點 Solder mask bleeding 滲油Board poor baking 焗壞板 Hand print 手印Ex

20、pose cu in hole 孔內露銅 Solder mask peel off 甩油Exposed conductors 露線 Over micro-etching 微蝕過度 S/M skip 漏印綠油 S/M on PAD 綠油上焊盤 S/M uneven 綠油不勻 Missing boards 遺失板S/M under developing 綠油沖不凈 Misuse W/F net 用錯 W/F網 Solder mask misregistration 綠油偏位 S/M thickness under spec. 油薄Solder mask blistering 綠油超泡 Solder

21、 mask over developing 綠油沖過度 Solder mask wrinkles 綠油起皺 Misuse solder mask 用錯油墨 Solder mask in hole 綠油入孔 S/M thickness over spec. 油厚S/M on gold finger 綠油上金手指C/M 白字C/M in hole 字符入孔 Plugging hole shift 塞偏孔C/M on PAD 字符油上焊盤 Unclear trademark 商標不清 Mark Illegible 字符不清 Double C/M 雙重白字 Legend dissolved 字符溶解

22、Poor carbon ink 碳油不良 Carbon ink on board 板面有碳油 Carbon ink short 碳油短路 Broken ink 爆油 Carbon ink saw-tooth shaped 碳油狗牙 Yellow C/M in hole 黃油入孔 Missing print C/M 印錯字符 Peelable mask in hole 藍膠入孔 Misuse black oil net 印錯黑油網 Missing plug hole 漏塞孔 Wrong trademark 印錯商標 Missing C/M 漏印字符 Askew C/M 印歪字符 S/M bloc

23、king hole 綠油塞孔 Misuse C/M net 印錯字符網 Poor plug hole 塞孔不良 Exposed conductor 露導體Page 3 of 5Illegible legend 字符殘缺 Carbon ink peel off 甩碳油 Carbon ink bleeding 滲碳油 C/M peel off 甩字符 Return cycle print 返印周期 Misuse carbon ink net 用錯碳油網 Solder powder 錫粉HAL 噴錫Scratching solder legend 擦傷錫字 Solder thickness over

24、 spec. 錫厚Dent in gold finger 金手指凹痕 Solder thickness under spec. 錫厚度不足 Scratching gold finger 金手指擦花 Gray solder 錫面灰 Expose cu on gold finger 金手指露銅 Tin blocking hole 錫塞孔 Solder on gold finger 金手指上錫 Line peel off 線路剝離 Dirty hole 孔灰 Solder on trace 線路上錫 Poor melting 熔錫不良 Solder on S/M 板面上錫 PAD peel off

25、甩焊盤 Non-wetting 不上錫 Copper peel off 甩銅 Solder whiten 錫白Solder peel off 甩錫 Solder surface roughness 錫面粗糙 Excessive solder 錫高 Solder thread in hole 孔內錫絲 Dewetting 縮錫 Undersized hole 孔細SMT PAD damaged 損壞錫手指 Rust solder 銹色G/F plating & Immersion gold 金手指電鍍 &沉金Gold burnt in plating 電鍍燒金 Gold blee

26、ding 滲金Poor gold plating 鍍金不良 Water residue 水漬印 Poor Ni plating 鍍鎳不良 Poor gold stripping 褪金不良 Gold plating skip 漏鍍金 White hole edge 孔邊發白 Ni plating skip 漏鍍鎳 No gold in hole 孔內無金 Ni thickness under spec. 鎳薄 Gold on guide hole 管位孔上金 Gold on trace 線路上金 Gold or Ni peel off 甩金鎳 Ni or gold skipping SKIP W

27、atercolor printing 水紋印Gold on the edge 板邊有金 Chemical solution on goldsurface藥水上金面Poor gold immersion 沉金不良 Rough G/F 金手指粗糙 Gold whiten 金白 G/F damaged 金手指損壞 Gold thickness under spec. 金薄 Ni spot on board surface 板面鍍上鎳 Poor gold color 金顏色不良 Nodule on G/F 金手指有突出塊 Pin hole on G/F 金手指針孔Profiling 外形加工Poor

28、V-cut V 坑不良 Board damaged by punching 啤壞板Too shallow V-cut V 坑過淺 Damage G/F by punching 啤壞金手指 Excess depth of V-cut V 坑過深 Damage board by model 啤模壓傷V-cut shift V 坑偏位 Double V-cut 雙重 V 坑 Dimension not meet requirement 尺寸不合要求 Out of upper tolerance 外圍偏大 Missing V-cut 漏 V 坑 Out of lower tolerance 外圍偏小M

29、iss routing board 漏鑼板 Poor bevel 斜邊不良Miss punching boards 漏啤板 Board cracked by punching 啤爆板Poor routing edge 鑼邊不良 Bevel edge over size 斜邊偏大Board damaged by routing 鑼壞板 Bevel edge under size 斜邊偏小Poor punch 啤板不良 Missing slot hole 漏 SLOT 孔 Hole cracked by punching 啤爆孔 Missing routing G/F bevel edge 漏鑼

30、G/F斜邊 Damaged board 爛板 Miss routing hole 漏鑼孔Measling after punching 啤后有白點 Miss punching hole 漏啤孔Rouging board scrapped by machine 機械鑼壞板 Outdated boards 周期過期Others 其它Unclear E-T E-T 印不清 Outdated boards 過期板 Damaged edge 板邊損壞 Old boards(stocked boards 舊板 (存倉板 Damaged corner 板角損壞 Old boards (customers c

31、leanboard舊板 (客清板 Page 4 of 5Dent by E-Test 電測壓傷 Customer returned boards 客戶退貨 Broken board 斷板 Collected mantissa boards 清尾數板 Missing E-T stamp 漏蓋 E-T 印 Wrong REV 做錯 REV Out of inner scraps 超出內層報廢 ME trial ME 試驗 Old REV 舊 REVPE scrap PE 報廢 Receive extra order 接多單QA trial QA 試驗 PPC changed revision PPC 轉版本 ME take board ME 取板PE take board PE 取板 Overdue prepreg 過期 P 片 QA take board QA 取板 Prepreg broken P 片折裂 PMC take board PMC 取板 Black yarn 黑紗Return to material vendor RTV 物料供應商 Black spot 黑點Return to machine vendor RTV 機器供應商 Prepreg wrinkle P 片折痕 Return to subcontractor RTV 外發供應商 Resin