質量控制 ■臺式產品運營中產品種類：型號及版本：IntelB250mATXMBECSB250-S評測工程師：方濤供應廠商：制造廠商/質量控制 ■臺式產品運營中產品種類：型號及版本：IntelB250mATXMBECSB250-S評測工程師：方濤供應廠商：制造廠商/生產廠商：同方股份有限公司（精英應有影響EMI的選項）對應驅動光盤路徑（按操作系統分類編號1I/O片12I/O廠商自帶擋片，型 20-340-KX8174應有影響EMI的選項）對應驅動光盤路徑（按操作系統分類編號1I/O片12I/O廠商自帶擋片，型 20-340-KX81742.1、適用機部件適用的同方整機機型、部件整機產品種類整機產品型號整機產2.1、適用機部件適用的同方整機機型、部件整機產品種類整機產品型號整機產品同方CCC報告號結果BB1INTEL網口個數：1□百兆■30M-1GEMI告號□百兆傳導報告1INTEL網口個數：1□百兆■30M-1GEMI告號□百兆傳導報告□千兆傳導報告2板（PCB*UL認證號:3核數、同一最高4****5*（如硬盤保護卡生產廠名稱制造商名稱注3：部件變更（有料件變更時）鉛汞鎘六價 多溴二苯注3：部件變更（有料件變更時）鉛汞鎘六價 多溴二苯▲○○○○○：表示該有毒有害物質在部件所有均質材料中的含量均在GB/T26572-2011規定的▲：表示該有毒有害物質至少在該部件的某一均質材料中的含量超出GB/T26572-×：表示該有毒有害物質至少在部件的某一均質材料中的含量超出GB/T26572-RoHS指令（包括其豁免條款臺式主板節能和能效指（臺式主板節能和能效指（主板可裝配CPU類別可為多能報告中每類的最高配配置：新主板+雙核最高主頻CPU+集顯+4G內存 LINUX三種操作系統主板型號 ；制造商 B在空閑狀態下：一級≤31.0W;二級≤45.0W; 主板可裝配CPU雙 型號 Inteli3- 主頻 GHz制造商B類 在空閑狀態下：一級≤31.0W;二級≤45.0W; 定型檢驗報告模板參考TFPC/DD-N-08定型檢驗報告模板參考TFPC/DD-N-08雙 型號 Inteli3- 主頻 GHz制造商B類 LINUX操作系統在空閑狀態下：一級≤31.0W;二級≤45.0W; 主板可裝配CPU□雙 主頻 GHz制造商B類 評測結果:■通 □不通1P23電源（除電源適配器456P78所有帶風扇部件（91P23電源（除電源適配器456P78所有帶風扇部件（9且檢測值低于B級標準線4有I/O卡、鍵盤、鼠標、顯示器、LCDP符合GB9254-2008且低于B騷擾應符合GB9254-2008且低于B級標準線4dB(μV)。PGBGB/T符合GB9254-2008且低于B騷擾應符合GB9254-2008且低于B級標準線4dB(μV)。PGBGB/T浪涌（沖擊burninPPPPP浪涌（沖擊burninPPPPPPP注GB/T26125-2011、P注GB/T26125-2011、PCQC3114-2009標準。PP注一 技術規ProcessorINTELKABYLAKE-HSocketLGAChipsetINTELPCBPCBPCBPCBModel注一 技術規ProcessorINTELKABYLAKE-HSocketLGAChipsetINTELPCBPCBPCBPCBModelGE-PCBVRDVRMICPWM.ICPWMDRIVER.RT9624FGQW..WDFN8PAXGICRT3606BCGQW..WQFN3Main5V/3.3VPWMTRG..TQFN20PICPWM.MEMPWMTRG..TQFN20PICPWM.DualRT3606BCGQW..WQFN3Main5V/3.3VPWMTRG..TQFN20PICPWM.MEMPWMTRG..TQFN20PICPWM.DualDDR41866/2133/2400TotalMAX2ECCICName& ICSUPERBX..LQFPICName&REALTEK/ICRTL8111GN..QFNICName& ICALC662-VD0..LQFP6AMPVGA ICF/WVGACONV.IT6516BFN/CX-QFNOnboardICName& ICALC662-VD0..LQFP6AMPVGA ICF/WVGACONV.IT6516BFN/CX-QFNOnboardOnboardUSBICName&BIOSTotalUSB2PCSConnectorports/2PCSHeader(四口)TotalUSB2PCSConnectorports/2PCSHeader(四口)OnboardYESPCI-E1PCI-E1PCIEx16PCI-E11MiniPCIEMiniPCIEM.2M.21RearTotalUSB2PCSConnectorports/2PCSHeader(四口)OnboardYESPCI-E1PCI-E1PCIEx16PCI-E11MiniPCIEMiniPCIEM.2M.21RearAudioe-FrontMonoFrontFrontFrontWIFI/BT/LANCaseAudioe-FrontMonoFrontFrontFrontWIFI/BT/LANCaseMotherboardMainComponentChipset ICPCH.KABYLAKE-HB250A0..FCBGA885P...SR2WC.Memorytype:DDR4Supportmax支持CPU最大功率MotherboardMainComponentChipset ICPCH.KABYLAKE-HB250A0..FCBGA885P...SR2WC.Memorytype:DDR4Supportmax支持CPU最大功率SATAcontroller:4SATASupportUSB:Support2pcsUSB3.0PortsforConn/4PortsforHeader---2pcsUSB2.0PortsConn/4PortsforA:ThermalHDMIHDSY/HI-RAIDWakePowerACPIRTCOnboardPS/2AUDIO 5.1ChannelA:AUDIO 5.1ChannelA: A: A:BIOSCHIP ROM1A:B:C: A: A:B: UPI:A: A:B: UPI:A:B: A:B:C: A:B:C: A:B:C: A:B:C:PCIEto IT8893EA: PCIEto IT8893EA: A:ImportantelectroniccomponentMOSFET(QCH1,QCH2,QCH3MOSFETN-CH.SM4377NSKPC-TRG..Vds=30V,Vgs=20V.Id=50A.Rds(on)=7mOHM.KPAK MOSFETN-CH.QM3090M6..=6.4mOHM.PRPAK5X68P..UBIQOHM.POWERDFN5X6 A:B:C:NIKO-MOSFET(QCL1,QCL2,QCL3MOSFETN-CH.SM4364NAKPC-s(on)=5.7m LEADFREE.MOSFETN-CH.QM3110M6..Vds=30V,Vgs=20V.Id=81A. MOSFETN-CH.PK618BA..OHM.POWERDFN5X68P A:B:C:NIKO- MOSFETN-CH.SM4377NSKPC-TRG..Vds=30V,Vgs=20V.Id=50A.Rds(on)=7m A:B:MOSFETN-CH.QM3090M6..=6.4mOHM.PRPAK5X68P...UBIQOHM.POWERDFN5X68P C:NIKO- MOSFETN-CH.QM3090M6..=6.4mOHM.PRPAK5X68P...UBIQOHM.POWERDFN5X68P C:NIKO- MOSFETN-CH.SM4364NAKPC-s(on)=5.7m LEADFREE.MOSFETN-CH.QM3110M6..Vds=30V,Vgs=20V.Id=81A. MOSFETN-CH.PK618BA..OHM.POWERDFN5X68P A:B:C:NIKO- MOSFETN-CH.SM4377NSKPC-TRG..Vds=30V,Vgs=20V.Id=50A.Rds(on)=7mOHM.KPAK MOSFETN-CH.QM3090M6..=6.4mOHM.PRPAK5X68P..UBIQOHM.POWERDFN5X6 A:B:C:NIKO- MOSFETN-CH.SM4364NAKPC-s(on)=5.7m LEADFREE.MOSFETN-CH.QM3110M6..Vds=30V,Vgs=20V.Id=81A. MOSFETN-CH.PK618BA..OHM.POWERDFN5X68P A:B:C:NIKO- MOSFETN-CH.SM4377NSKPC-TRG..Vds=30V,Vgs=20V.Id=50A.Rds(on)=7mOHM.KPAK MOSFETN-CH.QM3090M6..=6.4mOHM.PRPAK5X68P..UBIQ MOSFETN-CH.SM4377NSKPC-TRG..Vds=30V,Vgs=20V.Id=50A.Rds(on)=7mOHM.KPAK MOSFETN-CH.QM3090M6..=6.4mOHM.PRPAK5X68P..UBIQOHM.POWERDFN5X6 A:B:C:NIKO- MOSFETN-CH.SM4364NAKPC-s(on)=5.7m LEADFREE.MOSFETN-CH.QM3110M6..Vds=30V,Vgs=20V.Id=81A. MOSFETN-CH.PK618BA..OHM.POWERDFN5X68P A:B:C:NIKO- E/COperatingTemperatureRange:55℃toESR:12mΩ(atA:B:C:ECAP_CPU_OUT1(EC25,EC27,EC32,EC36,EC37)E/COperatingTemperatureRange:-55℃to+105℃;A:B:C: E/COperatingTemperatureRange:-55℃to+105℃;A:B:C: OperatingTemperatureRange:--55℃A:B:C: OperatingTemperatureRange:--55℃A:B:C: OperatingTemperatureRange:-55℃to+105℃; E/C55℃to+105℃;A:B:C:EC21)E/C55℃to+105℃;100ktoA:B:C: L4,L6,L9POWER B:C: POWERA:B:C:JUMPERSANDCONNECTORS C: POWERA:B:C:JUMPERSANDCONNECTORS A:B:C:(DIMM1,DIMM2180D.15u.BLUEA:B:□C(PCIE16XA:B:PCIE_X1A:B:C:( 16X..164P..W/TWOSIDEA:B: SLOT.PCI..120PA:B:C:M.2(NGFF3,NGFF1 SLOT.PCI..120PA:B:C:M.2(NGFF3,NGFF1NGFF3:SLOT.NGFFM.2..67P2R90DSMD..H6.7.BLACKNGFF1:SLOT.NGFFM.2..67P2R90DSMD..H8.5.BLACKA:B:C:3,SATA4)A:B:HI-C: CONN.D-TYPEMTIN..9P2RA:B:FENC: B:C: CONN.D-TYPEFMTIN..15P3R90D.BLUEA:B:C: CONN.D-TYPEFMTIN..15P3R90D.BLUEA:B:C: 26A:B:C:(_34USB3.0.PIN20EMPTY…A:B:C:HI-(R_USB3_12A:B:C:HI-(R_USB2_12_LANCONN.USBDUALRG/O).1000TRANSA:B:(_34 B:C: JACKA:B:C: JACKA:B:C: PSKB