塑膠電鍍介紹

PlatingonPlastics

塑膠電鍍介紹PlatingonPlastics塑膠電鍍?cè)砑白⒁馐马?xiàng)PrinciplesofPlatingonPlastic第一站素材選擇ABS塑料案例(Step1:SelectingMaterialABSPlasticCase)1.最好採(cǎi)用電鍍級(jí)ABS塑膠如圖所示其丁二烯含量15%~16%密著強(qiáng)度最好

SelectstheABSplasticsshowingontherightwhichthebutadieneis15%-16%.Itsadhesionisbest.2.采用70%~95%PC+ABS材料要請(qǐng)供應(yīng)商提供防火材料%、PC%、等相關(guān)資料

Appliershouldofferfireproofmaterial,PC%,etc,andreferencesbeforeselecting

70%-95%PC+ABS.3.塑膠電鍍?cè)蠎?yīng)完全乾燥(含水率0.1%以下)

Materialsofplatingonplasticshouldbedriedtotally.4.塑膠電鍍?cè)媳M量避免染色Materialsofplatingonplasticmustpreventdyeing.5.塑膠電鍍?cè)蟄L認(rèn)證MaterialsofplatingonplasticshouldbeattestedbyUL.0.51.52.02.53.03.54.04..51.0141915161718密著強(qiáng)度Kgf/cm丁二烯ｗt%各材質(zhì)丁二烯之含量塑膠電鍍介紹PlatingonPlastics塑膠電鍍?cè)砑白⒁馐马?xiàng)第二站模具設(shè)計(jì)Step2:MouldDesign1.塑膠電鍍模具必須預(yù)留電鍍夾具掛架點(diǎn)(以防產(chǎn)品變形及生產(chǎn)便利性)Remainspointsforelectroplatingrackinmouldofplatingonplastic.2.模具設(shè)計(jì)趨向：耐高溫不易頂開(kāi)產(chǎn)生毛邊、射出點(diǎn)不可太細(xì)以防入水?dāng)嗔衙撀?、預(yù)防尖端放電(加框)、注意離模斜度、預(yù)留排氣孔、注意頂針粗細(xì)影響外觀及進(jìn)膠口位置產(chǎn)生之結(jié)合線等Trendofmouldsdesign:Mouldsshouldofberesistanttohightemperatureandnoteasilyopentocreatecrudeoutline,theejectionpointshouldnotbetoosmalltoprevententeringwaterandbreaking.Preventsdischargeoftip.Remindstheventilator.Paysattentiontothatthicknessoftipwillinfluencetheexteriorandthecombinationlinecreatedintheejectionhole.

5.模具需預(yù)留電鍍後膜厚及組裝間隙Remainthethicknessofmembranewhichformedafterelectroplating.3.塑膠電鍍模具成型盡量避免尖端設(shè)計(jì)，盡可能改為R角Adoptsroundcornerinsteadoftipcornerinmoulddesign.4.模具孔洞盡量設(shè)計(jì)導(dǎo)通，預(yù)防殘留藥水不易清洗Designspassageintheholetocleantheremnants.塑膠電鍍介紹PlatingonPlastics塑膠電鍍介紹PlatingonPlastics塑膠電鍍?cè)砑白⒁馐马?xiàng)第三站成型射出FormationandEjection5.尺寸確認(rèn)：依廠商訂定長(zhǎng)寬尺寸、範(fàn)圍Affirmingthesize:decidesthesizeandrangeoflenthandwidthaccordingtotherequirementofthefirm.2.射出參數(shù)在不頂模、不起毛邊狀況下，盡可能拉高樹(shù)脂溶解溫度及模溫溫度，降低射出壓力及射出速度，以減少應(yīng)力產(chǎn)生TheejectionparametersuchasplasticTmandmouldtempretureshouldriseashighaspossidbleandtheejectionstressandspeedshouldbereducedtolessenthestress.3.成形表面確認(rèn)：不可有感結(jié)合線、刮痕、頂凸、拉模、縮水、起蒼、包風(fēng)、及異色點(diǎn)(浮出表面上)等等Affirmingthesurface:Theremustbenocombinationline,scratch,etc.4.成型品包裝：用Tray(托盤)+紙箱，以防碰刮傷Packing:adopttrayandpapercasetopreventbeingscratched.1.脫模劑最好能不用，要用務(wù)必使用含氟水性脫模劑Avoidusingthemouldreleases,ifitisessentialtouseone,theFluorine-typemaybeusedspringly.塑膠電鍍介紹PlatingonPlastics塑膠電鍍?cè)砑白⒁馐马?xiàng)模溫與密著力關(guān)系relationbetweentempretureofmouldandadhesion樹(shù)脂溶溫度與密著力關(guān)系relationbetweenplasticmeltingtemperatureandadhesion射速與密著強(qiáng)度關(guān)系relationbetweenspeedofejectionandadhesion密著力(kgf/cm)Adhesion密著力(kgf/cm)Adhesion密著力(kgf/cm)Adhesion模溫(°C)tempretureofmould溶融溫度(°C)tempretureofplasticmelting射出速度(mm/sec)speedofejection0134201342013425060708021022023024025020000010305070塑膠電鍍介紹PlatingonPlastics第四站防鍍方式MethodsofPlating-proof塑膠電鍍?cè)砑白⒁馐马?xiàng)1.與機(jī)構(gòu)R&D、RF、EMI、ESD、電子等人員討論絕緣區(qū)位置、熱溶點(diǎn)位置、卡勾防鍍、耳機(jī)孔迴朔、EMI歐姆值Discussespositionofinsulationareaandmeltingpoint,plating-proofofhooksinrack,EMIohm.2.防鍍方式：噴塗、貼膠、蝕刻、照影、印刷(依需求而決定)MethodofPlating-proof:sprayingpaint,etching,printing,etc.(decidedby

requirements)塑膠電鍍介紹PlatingonPlastics硬度耐溶劑抗紫外線表面細(xì)膩邊緣覆蓋作業(yè)性膜厚均勻耐磨性R.C.A

價(jià)格技術(shù)性灰塵毛屑附著液體垂涎電子功能EMIESD量產(chǎn)性良率金屬感電器電鍍>9H以上優(yōu)良優(yōu)良優(yōu)良優(yōu)良複雜優(yōu)良優(yōu)良通過(guò)

普通高不會(huì)不會(huì)優(yōu)良普通優(yōu)良真空濺鍍+UV烤漆

3H優(yōu)良優(yōu)良普通普通普通普通通過(guò)普通普通會(huì)會(huì)需二次加工優(yōu)良普通彩色電鍍5H優(yōu)良優(yōu)良優(yōu)良優(yōu)良複雜優(yōu)良優(yōu)良通過(guò)貴高不會(huì)不會(huì)優(yōu)良普通優(yōu)良I.M.D4H優(yōu)良通過(guò)優(yōu)良普通普通普通通過(guò)普通普通會(huì)會(huì)需二次加工優(yōu)良普通PU烤漆2HNG通過(guò)普通普通普通普通NG普通普通會(huì)會(huì)需二次加工優(yōu)良普通UV烤漆3H優(yōu)良優(yōu)良普通普通普通普通通過(guò)普通普通會(huì)會(huì)需二次加工優(yōu)良普通PVDTiNZrN

>9H以上優(yōu)良優(yōu)良優(yōu)良優(yōu)良複雜優(yōu)良優(yōu)良通過(guò)最貴高不會(huì)不會(huì)優(yōu)良普通優(yōu)良水轉(zhuǎn)印2HNGNG普通普通普通普通NG普通普通會(huì)會(huì)需二次加工優(yōu)良普通方法項(xiàng)目工業(yè)塑膠表面處理比較表塑膠電鍍介紹PlatingonPlastics

HardnessResistancetosolventANTI-UVFinenessofsurface

Vergecoverage

operationEvennessofmembrane

R.C.A

price

Techniquenorm

Adhesionofdust

DroppingofliquidElectricpowerfunctionEMIESD

quality

ofbatchproduction

SenseaboutmentalElectricalApplianceplating

>9HgoodgoodgoodgoodcomplexgoodPasssuccessfullyaverageHIGHNOYESgoodaveragegoodSprayingpaintinvacuum+UVpaint

3HgoodgoodaveragegoodaverageaveragepaverageaverageYYSecondaryprocessisnecessarygoodaverageColorplating5HgoodgoodgoodgoodcomplexgoodPasssuccessfullyexpensiveHIGHNNOgoodgoodgoodI.M.D4HgoodpassgoodgoodaverageaveragepassaverageaverageYYSecondaryprocessisnecessarygoodaveragePUpaint

2HNGpassaveragegoodaverageaverageNGaverageaverageYYSecondaryprocessisnecessarygoodaverageUVpaint3HgoodpassaverageaverageaverageaveragepassaverageaverageYYSecondaryprocessisnecessary

goodaveragePVDTiNZrN

>9H

goodpassgoodgoodcomplex優(yōu)良Passsuccessfully

extremelyexpensivehighNONgood優(yōu)良Printinwater

2HNGNGaverageaverageaverageaverageNGaveragehighYNsecondaryprocessisnecessary

goodaverageItem

ChartofTreatmentsonPlasticSurfacegoodgood

averageMethod塑膠電鍍介紹PlatingonPlasticsPrinciplePossibilities原理Pop_met0IonicCatalystLonic催化劑ColloidalCatalyst膠狀催化劑ConductiveSurface傳送面FinalLayers最終層Electroplating電鍍Electroless

MetallDeposition無(wú)電鍍金屬沉澱SwellandEtch粗化ChromosulfuricAcidEtch鉻酸＋硫酸粗化ComparisonofFoxconn‘sProcesses制程對(duì)比Compa201.pptCleaner(Option)清潔劑（任選）CrO3-Etch粗化Reducer還原劑PrePlateNicke預(yù)鍍鎳Electroplating電鍍Accelerator加速劑Coll.Pd–Catalyst離子催化劑PreDip預(yù)浸E‘lessNickel化學(xué)鎳Cleaner(Option)清潔劑（任選）CrO3-Etch粗化Reducer還原劑Electroplating電鍍CuLink銅槽Coll.Pd–Catalyst離子催化劑PreDip預(yù)浸Cleaner(Option)清潔劑（任選）Swell+Etch粗化Conditioner調(diào)解劑PrePlateNickel預(yù)鍍鎳Electroplating電鍍Reducer還原劑Ion.Pd–Catalyst離子催化劑E‘lessNickel化學(xué)鎳Cleaner(Option)清潔劑（任選）CrO3-Etch粗化Reducer還原劑PrePlateNickel預(yù)鍍鎳Electroplating電鍍Accelerator加速劑Coll.Ag–Catalyst離子催化劑E‘lessnickel化學(xué)鎳Cleaner(Option)清潔劑（任選）CrO3-Etch粗化PrePlateNicke預(yù)鍍鎳lElectroplating電鍍Reducer還原劑Ion.Pd–Catalyst離子催化劑E‘lessNickel化學(xué)鎳Noviganth341NoviganthAKFuturonNoviganthPA[Mellon]塑膠電鍍介紹PlatingonPlasticsStructureofPolymersonABS–BasisABS表面聚合物結(jié)構(gòu)－基Abs_stru0塑膠電鍍介紹PlatingonPlasticsTheoryofAdhesion:MechanicalInterconnection黏合原理﹕自動(dòng)連接Abs_aet30Toseparatethemetalfromthe

plastic,energymustbeapplied

tocompensatethecohesive

forcesintheplasticmatrix

(green)orinthemetal

(red).為將金屬?gòu)乃苣z中分離出來(lái)﹐必須要求有能夠同塑膠母體（綠色）和金屬（紅色）的能量相抵之能量﹒塑膠電鍍介紹PlatingonPlasticsTypical?Polycarbonate“Blends典型“多碳酸鹽”混合blends10BayblendT45BayblendFR1441Polycarbonate聚碳酸鹽Polyacrylonitrile聚丙烯腈

Polystyrene聚苯乙烯Polybutadiene聚丁二烯Filler,Pigments,...填充料顏料nArCNSANPB塑膠電鍍介紹PlatingonPlasticsSomePlateableGradePlastics可電鍍塑膠galvsub0Typ類型Name名稱Supplier供應(yīng)商ABSABS+PCPPOPPPALCPTPONovodurP2MC,PM3C

Cycolac

LustranPG299

RonfalinCP55BayblendT45

CycoloyNorylPN235Codyx4019GDurethanBM240

Minlon73M40

UltramidB3M6

IXEFBayerAG

GeneralElectrics

Monsanto

DSMBayerAG

GeneralElectricsGeneralElectricsRTPBayerAG

DuPont

BASF

SolvayVectraHoechstAGRDP98119Solvay塑膠電鍍介紹PlatingonPlastics

PerfectlyPretreatedABSSurface(SEM,5000x)完全粗化處理之ABS表面（SEM﹐5000x）absaet10塑膠電鍍介紹PlatingonPlasticsRinsing:Concept水洗﹕步驟Dragoutv=0,2l/m2Dragoutv=0,4l/m2Evaporation

apprx80l/hReducer還原劑RinsingCascade水洗過(guò)程Etch粗化(SprayRinseshavetwicedilutionfactor)2kgCrO3=100m2etchedABS

=5500Ah=230Ain24hR=C0/Cn=[Q/V]nCn=C0*[V/Q]n塑膠電鍍介紹PlatingonPlasticsEtchingRates

ofBayblend(25cm2)andResultingAdhesionofPlatedMetalLayer.Bayblend

(25cm2)粗化率及電鍍后之金屬面所產(chǎn)生的黏附力﹒etchrough000,20,40,60,811,21,41,60100200300400EtchingRate[mg]粗化率Adhesion[N/mm]黏附力塑膠電鍍介紹PlatingonPlasticsPalladium/TinCluster鈀/錫簇cluste10Cl-

Pd

Sn2+

0,181nm0,128nm0,093nmR.L.CohenK.W.West

J.Electrochem.Soc.120,502(1973)CoreDiameter:核心直徑3–4nmSn塑膠電鍍介紹PlatingonPlasticsElectrolessMetalDeposition(Model)化學(xué)金屬沉澱物eless00Activeplastic‘ssurface活性塑膠表面Startofmetal-

deposition.開(kāi)始出現(xiàn)金屬沉澱物Completemetalization:allactivatorparticlesare

connectedelectrically

conductive.金屬化完成﹕所有活性劑顆粒均結(jié)合在一起具導(dǎo)電性﹒塑膠電鍍介紹PlatingonPlastics

ElectrolessNickelDepositionI化學(xué)鎳沉澱物IStartingReaction初期反應(yīng)Adsorption

ofReducer還原劑吸附作用Protolysis質(zhì)子遷移Addition

ofWater附加水Desorption解吸附作用塑膠電鍍介紹PlatingonPlastics

ElectrolessNickelDepositionII化學(xué)鎳成份IISideReactions側(cè)邊反應(yīng)Recombination

ofHydrogenAtoms:

HydrogenGasEvolution氫原子再結(jié)合﹕成為氫氣?Reduction‘of

Hydroxide氫氧化物還原Phosphorous-

CoDeposition磷酸根沉澱物塑膠電鍍介紹PlatingonPlastics

ElectrolessNickelDepositionIII化學(xué)鎳成份IIIMetalDeposition金屬沉澱物MainReac