高性能32位藍(lán)牙音頻應(yīng)用處理版日版描改動命名方式概 結(jié)構(gòu)示意 數(shù)字IO電特 音頻性 封裝尺 和焊 技術(shù)支 圖圖 圖 圖3.封裝形式和尺 表表 表2GPIO上電狀態(tài)及電 表 表6AudioDAC性能@ 表7AudioADC（LINEIN1/3通道）性能@ 表8AudioADC（LINEIN4/5通道）性能@ 表9AudioADC（麥克風(fēng)通道）性能@ 概內(nèi)核和支持DSP指令，集成FPU支持浮點運算 內(nèi) 燒 2SDP（SerialDebugPort）調(diào)試口，具備斷音ADC8KHz11.025KHz12KHz16KHz22.05KHz24KHz32KHz44.1KHz/324bitDACDAC8KHz11.025KHz12KHz16KHz22.05KHz24KHz32KHz44.1KHz/位寬32bits工），支持音頻和ARC

藍(lán) 接收靈敏度PLCPackageLoss電源、時鐘和復(fù)位DC3.3V~5V電源供電@ 檢測）和Watchdog外 點，內(nèi)置PHY1SPISlave@1SDIO@UART0支持流控112-bitSAR-ADC（ADC）@max.450K15IO通道，2個內(nèi)部電壓采樣通道（OTG、IR和I2C除外軟件開發(fā)支持 :MP2，MP3，WMA，APE，F(xiàn)LAC，AAC，MP4，M4A，WAV（IMA-ADPCM&PCM），AIF，AIFC編碼MP2/MP3IMA-音效ProfessionalVoice 參量均衡器

回聲消除能的Example和眾多中間件。固件燒錄和保護(hù) 燒錄器或FlashBurner64-bituniqueEMC（電磁兼容封裝和工作溫度LQFP64（7mmx應(yīng)用領(lǐng)引腳定義和描述圖圖 GPIO管名類功能說明復(fù)用說明123456I789SPIS_MOSI/UART0_RXD/UART0_TXD/I2S0_MCLK_OUT/I2S0_MCLK_IN/TIM3_SPIS_CLK/UART0_TXD/UART0_RXD/I2S0_LRCLK/I2S1_LRCLK/TIM4_SPIS_MISO/UART0_CTS/I2S0_BCLK/SPIS_CS/UART0_RTS/I2S0_DO/I2S0_DI/RFIOLCD0/SPIM_MOSI/UART0_RXD/LCD1/SPIM_CLK/UART0_TXD/LCD2/SPIM_MISO/UART0_CTS/I2S1_MCLK_OUTLCD3/UART0_RTS/I2S1_LRCLK/LCD4/UART1_RXD/I2S1_BCLK/LCD5/UART1_TXD/I2S1_DO/I2S1_DI/LCD6/UART1_CTS/I2S1_DI/I2S1_DO/LCD7/GPIOLCD10/LCD11/LCD12/GPIOUSBDM/UART1USB_DP/AD0/SD_DAT/SPIM_MOSI/SPIS_MOSI/I2S0_LRCLK/AD1/SD_CLK/SPIM_CLK/SPIS_CLK/I2S0_BCLK/管名類功能說明復(fù)用說明AD2/SD_CMD/SPIM_MISO/SPIS_MISO/UART1_RTS//I2S0DI/TIM3LCD13/AD0/SPIS_CS/UART1_CTS/I2S0_DI/I2S0_DOLCD14/AD1/UART1_RXD/I2C_SDA/I2S0_MCLK_OUT/I2S0_MCLK_IN/TIM5_LCD15/AD2/UART1_TXD/I2C_SCL/GPIOAD4/I2S1MCLKOUT/I2S1MCLKIN/AD5/SPDIF_AI_0/I2S1_LRCLK/SPDIF_DI/SPDIF_DO/AD6/SPDIF_AI_1/I2S1_BCLK/SPDIF_DI/SPDIF_DO/CLKOUT/AD7/SPDIF_AI_2/I2S1_DO/I2S1_DI/I2C_SDA/SPDIF_DI/SPDIFDO/DMIC1DATAD8/SPDIF_AI_3/I2S1_DI/I2S1_DO/I2C_SCL/SPDIF_DI/SPDIF_DO/DMIC1_CLKEFUSEVDD/CLK_OUT/CLK_OUT/LINEIN4_R/AD9//LINEIN4_L/AD10/ /LINEIN5_R/GPIOLINEIN5L/DMIC0LINEIN3L/I數(shù)字輸入；O數(shù)字輸出；AI模擬輸入；AO模擬輸出；I/OPWR電源；GND名I/O電平狀名I/O電平狀CMOS工藝，建議對沒有和其他器件連接的GPIO引腳做內(nèi)部上拉或者下拉的配置，以免因電荷積累而導(dǎo)致該IO產(chǎn)生電流消耗。 電氣特表 IO電特性電參標(biāo)最典最單-℃VVVV符含最典最單測試條V-V-VV名對應(yīng)端普增單測試條GPIO_A[17:5]GPIO_A[25:24]/8GPIO_A[4:0]/GPIO_A[23:18]/GPIO_A[29:26]GPIO_B[3:0]/486AudioDAC@GPIO_A[17:5]/GPIO_A[25:24]/GPIO_A[4:0]/GPIO_A[23:18]/GPIO_B[3:0]/-參測試條最小典型最大單8-20samples串?dāng)_-參測試條最小典型最大單8-NoFilter@No9AudioADC（麥克風(fēng)通道）@@700mVrms，-20samples串?dāng)_-參測試條最小典型最大單8-No@No@700mVrms，-20samples串?dāng)_-參測試條最小典型最大單8--NoNo參測試條最小典型最大單GainBoost，PGA-GainBoost，PGAgain=0dB-20samples串?dāng)_-運行頻率和功耗 典型模電條BP1064A2isamoisturesensitivecomponent.ThemoisturesensitivityclassificationisClass3.It’simportantthatthepartsarehandledunderprecautionandapropermanner.Thehandling，bakingandout-of-packstorageconditionsofthemoisturesensitivecomponentsaredescribedinIPC/JEDCS-STD-033A.The mendsutilizingthestandardprecautionslistedCalculatedshelflifeinSealedBag:12monthsat<40℃and<90%relativePeakPackageBodyTemperature:Afterbagisopened，devicesthatwillbesubjectedtoreflowsolderofotherhightemperatureprocessmustbe:Mountedwithin168hoursoffactorycondition≤30℃/60%Storedat<10%RHifnotDevicesrequirebaking，beforemountingHumidityindicatorcardis>10%whenreadat23±5℃immedia yaftermoisturebarrierbagisItems3aor3bisnotIfbakingisrequired，pleaserefertoJ-STD-033standardforlowtemperature（40℃）bakingrequirementinTape/Reelform.Allinformationanddatacontainedinthisarewithoutanycommitment，arenottobeconsideredasanofferforconclusionofacontract，norshalltheybeconstruedastocreateanyliability.Anynewissueofthis invalidatespreviousissues.Productavailabilityanddeliveryareexclusivelysubjecttoourrespectiveorderconfirmationform;thesameappliestoordersbasedondelivereddevelopmentsamplesdelivered.Bythispublication，ShanghaiMountainViewSiliconCo.， .（“MVSILICON”）doesnotassumeresponsibilityforpatentinfringementsorotherrightsofthirdpartiesthatmayresultfromitsuse.Nopartofthispublicationmaybereproduced，photocopied，storedinaretrievalsystem，ortranslatedinanyformorbyanymeans，electronic，mechanical，ma