1、Value Enhancement of Critical Substrates for Flexible ElectronicsOutline Key issues in substrate quality Concept of “Total Cleen” technology Testing Test Results ConclusionsICFPE 201423Key Issues Identification of defect causes:Contamination Particles Organic and other contaminationSurface QualityPa

2、rticle Contamination Major cause of coating defects Can cause scratching of substrate Affects functionality Causes repeat defects at rewindICFPE 201445Organic Contamination Variation in wettability- over time and within a roll Increasing issue for thin coatings Increasing issue for low viscosity coa

3、tings Organics can cause point delamination pin holes Medical applications sterile is best Removing biologicals is an advantageCurrent Solutions Contact Cleaning of web before coating Removes Particles Atmospheric Plasma treatment Cannot remove particles Corona Treatment of web Removes organics and

4、very small particles but can damage surface Vacuum plasmaICFPE 20146The Concept - 1ICFPE 20147The Concept - 2ICFPE 201489DDBD ProcessVirgin Polymer Film SubstrateActivationAtmospheric Plasma Discharge ( ) Removal of weak boundary layers. Oxidation of uppermost atomic layer Bond-breaking, cross-linki

5、ng of surface molecules. OOOHOHCOOHOSurface Chemical Reaction (Non specific) Generation/bonding of polar groups. Unspecific reactions when only inert process gas used in presence of humid air.OHOHOHOHOH OHSurface Chemical Reaction (Specific) Generation/bonding of polar groups. Specific reactions whe

6、n defined reactive process gases used in controlled atmosphere.Conventional APDAtmosphere Controlled PD10 Testing Tests conducted by Eastman XPS performed by Material Interface Inc. Substrate Polyethylene Contains fast migrating Oleamide, typical Film Additive Measured Surface Chemistry with XPS Bef

7、ore and after TFC Measured Contact Angle across web width DDBD Parameters 43watt minutes/m2 100% Nitrogen11Test Results - XPS Change in Surface Chemistry indicates elimination of OleamideAnalysis of Polyethylene Samples as Obtained by XPS. Data Normalized Atomic % of Elements Above Atomic Number 2 w

8、ithin 40 of the Surface12Surface Energy Homogenous change across full web width 50% reduction in Contact Angle 90 to 50Conclusions Cleaning with unique sealed DDBD providesCleaning all contaminationSurface activationAbility to add reactants to change Surface chemistry and polarity Operates at normal line speeds and web widths Operates at atmospheric pressure Single process takes standard film and converts it into higher value consistent quality film suitable for demanding applications. ICFPE 201413Acknowledgements Eastman Chemical Company