1、ConfidentialYOULCHON EMI Shield FilmStorage & Handling YES-A20 YOULCHON CHEMICALR&D CenterIndustry Materials R&D Team2016. 03. 10Confidential2ConfidentialEMI shield film StructureProtection FilmConductive Adhesive LayerInsulation LayerCarrier Film2 layer structureInsulation + Conductive

2、AdhesiveStructureMaterial / featureThicknessCarrier FilmRelease Matt PET Film505Insulation layerModified Resin based204(After Press)Conductive adhesive layerModified Resin based(with metal filler)Protection FilmRelease PET Film7573Confidential Data is measured in the above, not guaranteed values. Da

3、ta is measured in the above, not guaranteed values. Warranty Warranty : : 3 months3 months- Conductivity : condition : Quick press (180, 120bar, 100sec) Baking(160, 3600s)- Solder Resistance (288, 10sec)- Peel strength (Cross Cut)Storage Warning & Shelf Life- Store it in low temperature & hu

4、midity (temp.: 53/ humidity: 4010%) away from direct sunshine.Retention periodStorage Temperature525400dayOOO1dayOOO2dayOOO3dayOOO4dayOO7dayOX10dayOX14dayOXX1month2month3month4month5month6monthEMI shield film Storage & Handling Product stability with the storage conditions Test 中4ConfidentialEMI

5、 shield film Storage & Handling Time to turn room temperature in the storage temperature Time for a stored film gets a room temperature, 25StorageTemperatureTime06 hr55 hr104 hr Allow Allow the refrigerated film with plastic wrap to stand at room temperature before using itthe refrigerated film

6、with plastic wrap to stand at room temperature before using it. . By By doing this, you can avoid deterioration from Dew condensationdoing this, you can avoid deterioration from Dew condensation. .Storage Warning & Shelf Life- Please restore the EMI shield film back to room temperature for 6hour

7、s more with wrapping.5ConfidentialPreparationRemoverelease filmPre-fixHot pressRemoveprotective filmHow to use for FPCBCarrier filmProtection filmConductive adhesiveInsulation EMI shield film FPCB Carrier filmProtection filmConductive adhesiveInsulationCarrier filmConductive adhesiveInsulationCarrie

8、r filmConductive adhesiveInsulationCarrier filmConductive adhesiveInsulation6ConfidentialIronSoldering ironPre-fixing Recommended Pre-Fix Condition 1.Release protection film from conductive layer.The conditions may vary depending on the conditions of the working plate.2.Place on the FPCB.3.Pre-fixin

9、g the film using a deviceSoldering ironIronPre-fixingCondition1501902sec10014025sec7ConfidentialPre-fixing Recommended Pre-Fix Condition IronFrom 100 to 140, use the available iron temperature control.Small iron is convenient.Soldering ironFrom 150 to 190, use the available soldering iron temperatur

10、e control.The tip of the soldering iron looks like the below picture is convenient for the operationThe conditions may vary depending on the conditions of the working plate.8ConfidentialHow to use Quick press How to Apply (Quick Press) u Recommended Lamination Condition1.Release protection film from

11、 conductive layer.2.Laminating on FPCB. (Tentative fastening)3.Heat press on insulation layer side with Carrier film.4.Release carrier film.5.Post cure.(Baking)Press ConditionsPost CureTemperatureForceTimeTemperatureTimeQuick Press& Post CurarMore than 100sec16010More than 60minThe

12、conditions may vary depending on the conditions of the press machine & cushioning material. Please check your preferred conditions before starting mass production.9ConfidentialHow to use Hot press How to Apply (Only Press) 1.Release protection film from conductive layer.2.Laminating on FPCB. (Te

13、ntative fastening)3.Heat press on insulation layer side with Carrier film over 60 min 4.Release carrier film.Press ConditionsPost CureTemperatureForceTimeTemperatureTimeQuick Press& Post Cure160102545kgF/More than 60min-u Recommended Lamination ConditionThe conditions may vary depending on the c

14、onditions of the press machine & cushioning material. Please check your preferred conditions before starting mass production.10ConfidentialvQuick Press Factors & LevelFactorUnitLevel-+1Temperature1601802002Forcebar1001201403Timesec60100Test DesignFactors & Level OvervieworderTemp.ForceTi

15、meorderTemp.ForceTime116010060101601001002160120601116012010031601406012160140100418010060131801001005180120601418012010061801406015180140100720010060162001001008200120601720012010092001406018200140100Test ResultorderConductivity()Solder Test(Pass/NG)orderConductivity()Solder Test(Pass/NG)11.3NG100.9Pass21.0NG110.8Pass30.9NG120.7Pass40.9NG130.5Pass50.6Pass140.4Pa